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Anisotropic conductive film and connection structure using the same

An anisotropic, conductive film technology, applied in the direction of conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, film/sheet adhesives, etc., can solve performance reduction, short circuit or contact Increased resistance and other problems, to achieve excellent insulation performance and connection reliability

Active Publication Date: 2020-12-29
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For a typical double-layer anisotropic conductive film, when the terminals are connected to each other by heating / compression, the film composition containing the conductive particles flows due to heat and pressure, thereby causing the effect of the particles for providing the connection between the terminals a fairly significant reduction in
In addition, when the composition containing the conductive particles partially flows into the adjacent space (space portion), the conductive particles are concentrated in a small area, causing a short circuit or an increase in contact resistance

Method used

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  • Anisotropic conductive film and connection structure using the same
  • Anisotropic conductive film and connection structure using the same
  • Anisotropic conductive film and connection structure using the same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0088] 1. Formation of conductive layer

[0089] 20 wt% of bidifenole-type binder resin (FX-293, NipponSteel Chemical Co., Ltd., Tg: 165°C, molecular weight: 45,000), 10 wt% of epoxy resin 1 were mixed as the first inorganic filler. (Celloxide2021P, DAICEL), 5wt% epoxy resin 2 (YDPN 638, Kukdo Chemical Company), 2wt% cationic curing agent (SI-B3A, Sanshin Chemical Industry Co., Ltd.), conductive particles (KSFD, average particle diameter: 3.0 μm, NCI), 3 wt % of silica (R812, Tokuyama corporation) having a particle diameter of 7 nm, and 20 wt % of a particle diameter of 50 nm and surface-treated with phenylamine groups as a second inorganic filler Silica (YA050C, Admatech) was used to prepare the conductive layer composition. The conductive layer composition was coated on a release film, and then the solvent was volatilized using a drier at 70° C. for 5 minutes, thereby obtaining a dry conductive layer with a thickness of 6 μm.

[0090] 2. Formation of Dielectric Layer

[0...

example 2

[0095] An anisotropic conductive film of Example 2 was produced in the same manner as in Example 1, except that silica (PM-20, Tokuyama) having a particle diameter of 14 nm was used as the first inorganic filler.

example 3

[0097] The anisotropic conductive film of Example 3 was produced in the same manner as in Example 1, except that silica (SC2030, Admatech) having a particle diameter of 500 nm and surface-treated with epoxy resin was used as the second inorganic filler except.

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PUM

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Abstract

The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having different diameters, and an increase rate in diffusion length, represented by the following formula 1, of the insulation layer is greater than that of the conductive layer when measured after preliminarily compressing the film under a condition of 50-80°C, for 1-3 seconds and at 1.0-3.0 MPa and mainly compressing the same under a condition of 120-160°C, for 3-6 seconds and at a pressure of 60-90 MPa, and the storage modulus is 2.5-5 GPa when cured at a cure rate of 90% or more. Additionally, there is an advantage of enabling insulation and connection reliability to be improved by increasing the dispersibility of conductive particles. [Formula 1] Increase rate in diffusion length (%) = [(Transverse length of the corresponding layer after main compression - Transverse length of the corresponding layer before preliminary compression) / Transverse length of the corresponding layer before preliminary compression] ×100

Description

technical field [0001] The invention relates to an anisotropic conductive film and a connection structure using it. Background technique [0002] In general, anisotropic conductive film (ACF) refers to a film-type adhesive prepared by dispersing conductive particles in a resin such as epoxy resin, and exhibits conductivity in the thickness direction of the film. properties and exhibit insulating properties in the direction of its surface anisotropic adhesive polymer film formation. When the anisotropic conductive film placed between the circuit boards to be connected is subjected to heating / compression under certain conditions, the circuit terminals of the circuit boards are electrically connected to each other via conductive particles, and insulating adhesive resin is filled between adjacent electrodes space to isolate the conductive particles from each other, thereby providing high insulation performance. [0003] For a typical double-layer anisotropic conductive film, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J7/10C09J11/04C09J9/02H01B1/20C09J163/00
CPCC09J9/02C09J11/04C09J163/00C09J7/10H01B1/20
Inventor 徐贤柱权纯荣金荷娜高连助宋基态
Owner KUKDO ADVANCED MATERIALS CO LTD