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Holding arrangement for holding a substrate, carrier comprising the holding arrangement, processing system using the carrier and method of releasing a substrate from the holding arrangement

A substrate and carrier technology, applied in a vacuum processing system, in the field of releasing the substrate from the holding arrangement, which can solve problems such as substrate cracking

Active Publication Date: 2020-12-11
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Substrate humping which in turn can be problematic due to increased likelihood of substrate cracking
Furthermore, it is challenging to release large area thin substrates from support systems such as substrate carriers without causing swelling or damage to the substrates

Method used

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  • Holding arrangement for holding a substrate, carrier comprising the holding arrangement, processing system using the carrier and method of releasing a substrate from the holding arrangement
  • Holding arrangement for holding a substrate, carrier comprising the holding arrangement, processing system using the carrier and method of releasing a substrate from the holding arrangement
  • Holding arrangement for holding a substrate, carrier comprising the holding arrangement, processing system using the carrier and method of releasing a substrate from the holding arrangement

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Embodiment Construction

[0028] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in each of the accompanying drawings. Each example is provided by way of illustration, not limitation. For example, features illustrated or described as part of one embodiment can be used on or in combination with any other embodiment to yield a further embodiment. The present disclosure includes such modifications and variations.

[0029] In the following description of the drawings, the same reference symbols refer to the same or similar components. In general, only differences with respect to individual implementations are described. Unless otherwise specified, descriptions of a part or aspect of one embodiment are also applicable to corresponding parts or aspects of another embodiment.

[0030] Before describing in detail various embodiments of the present disclosure, some aspects regarding some terms used herein are explained.

[0031] In this disclosure, ...

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Abstract

A holding arrangement (100) for holding a substrate (101) is described. The holding arrangement comprises a main body (110), an adhesive arrangement (130) and a force transmitting arrangement (140). The body (110) has a first wall (120) composed of a flexible material. An adhesive arrangement (130) is used for attaching the substrate, wherein the adhesive arrangement (130) is provided on the first side (121) of the first wall (120). The force transmission arrangement (140) is for applying a force to a second side (122) of the first wall (120), the second side (122) being opposite to the first side (121) of the first wall (120).

Description

technical field [0001] Embodiments of the present disclosure relate to a holding arrangement for holding a substrate, a carrier for holding a substrate, a processing system for processing a substrate, and a method of releasing a substrate from the holding arrangement. Embodiments of the present disclosure relate in particular to a holding arrangement for holding a substrate during substrate processing in a vacuum processing chamber, a carrier for holding a substrate in a vacuum processing chamber, a A vacuum processing system, and a method for releasing a substrate after substrate processing, particularly coating. Background technique [0002] Techniques for layer deposition on substrates include, for example, thermal evaporation, chemical vapor deposition (CVD) and physical vapor deposition (PVD), such as sputter deposition. A sputter deposition process may be used to deposit a layer of material, such as a layer of insulating material, on a substrate. During a sputter dep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50C23C14/56C23C16/458C23C16/54H01L21/67H01L21/683H01J37/32
CPCC23C14/50C23C14/562C23C16/458C23C16/545H01L21/67092H01L21/6734H01L21/67712H01L21/68735H01L21/6875H01J37/32715H01J37/32816C23C14/56C23C16/4582C23C16/54H01L21/67132H01L21/683
Inventor 西蒙·刘
Owner APPLIED MATERIALS INC