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Nano-silicon polymerization heat insulation board

A technology of thermal insulation board and nano-silicon, which is applied in the field of building thermal insulation materials, can solve the problems of low flame retardancy of thermal insulation boards, and achieve the effects of cost saving, low free formaldehyde content, and uniform overall characteristics

Inactive Publication Date: 2018-07-24
廊坊暖康管业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a nano-silicon polymer insulation board, which has solved the technical problem of low flame retardancy of the existing insulation board

Method used

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  • Nano-silicon polymerization heat insulation board
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  • Nano-silicon polymerization heat insulation board

Examples

Experimental program
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Embodiment 1

[0027] This embodiment provides a nano-silicon polymer insulation board, which is made through the following steps:

[0028] Step 1: Dissolve 10L of hydrochloric acid with a concentration of 2mol / L and 1020g of aluminum oxide in 10L of water, heat and keep the temperature at 50°C, add 10L of ethylenediaminetetraacetic acid with a concentration of 2mol / L under stirring and continue stirring , obtain aluminum-containing organic ion solution after fully reacting;

[0029] Step 2: Add 600g of silica airgel to the aluminum-containing organic ion solution prepared in step 1, stir at 90°C until volatilized and dry, and keep 650°C in a crucible furnace for roasting to obtain a coated three Silica airgel of alumina;

[0030] Step 3: the silicon dioxide airgel coated with Al2O3 prepared in the parts by weight is 300g melamine resin, 10g phosphoric acid, 20g adipic acid, 60g sodium lauryl sulfate and 700g step 2 and mix in Foaming at 50°C to prepare nano-silicon polymer insulation boar...

Embodiment 2

[0032] This embodiment provides a nano-silicon polymer insulation board, which is made through the following steps:

[0033] Step 1: Dissolve 10L of hydrochloric acid with a concentration of 3mol / L and 1020g of aluminum oxide in 10L of water, heat and keep the temperature at 70°C, add 10L of ethylenediaminetetraacetic acid with a concentration of 3mol / L under stirring and continue stirring , obtain aluminum-containing organic ion solution after fully reacting;

[0034]Step 2: Add 1200g of silica airgel into the aluminum-containing organic ion solution prepared in step 1, stir at 110°C until volatilization and dryness, and keep calcination at 550°C in a crucible furnace to obtain coated three Silica airgel of alumina;

[0035] Step 3: the silicon dioxide aerogel coated with Al2O3 that the parts by weight are 500g melamine resin, 25g phosphoric acid, 25g adipic acid, 90g sodium lauryl sulfate and 400g step 2 make and mix in Foaming at 50°C to prepare nano-silicon polymer insul...

Embodiment 3

[0037] This embodiment provides a nano-silicon polymer insulation board, which is made through the following steps:

[0038] Step 1: Dissolve 10L of hydrochloric acid with a concentration of 2.5mol / L and 1020g of aluminum oxide in 10L of water, heat and keep the temperature at 60°C, add 10L of ethylenediaminetetraacetic acid with a concentration of 2.5mol / L under stirring and Continue to stir, and obtain an aluminum-containing organic ion solution after fully reacting;

[0039] Step 2: Add 900g of silica airgel into the aluminum-containing organic ion solution prepared in step 1, stir at 90°C until volatilized and dry, and keep calcination at 600°C in a crucible furnace to obtain the coated three Silica airgel of alumina;

[0040] Step 3: Prepare modified melamine resin, dissolve 1260g melamine, 880g vinyl alcohol, and 750g formaldehyde in 10L water at 80°C, add sodium hydroxide to adjust the pH to 8.5-9.0 for reaction, and after the reaction liquid is clarified, obtain Meth...

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Abstract

The invention provides a nano-silicon polymerization heat insulation board and relates to the technical field of building heat insulation materials, aiming at solving the problem of an existing heat insulation board that the flame-retarding performance is low. The nano-silicon polymerization heat insulation board is prepared through the following steps: step 1: dissolving hydrochloric acid and aluminum oxide into water; heating and keeping temperature at 50 to 70 DEG C; adding ethylenediamine tetraacetic acid under a stirring state and continuously stirring; after sufficiently reacting, obtaining an aluminum-containing organic ion solution; step 2: adding nano-grade silicon dioxide particles into the aluminum-containing organic ion solution prepared by step 1 and stirring at 90 to 110 DEGC until the solution is volatilized and dried; roasting at 550 to 650 DEG C to obtain aluminum oxide cladded silicon dioxide particles; step 3: mixing the following components in parts by weight: 30 to 50 parts of melamine resin, 3 to 5 parts of curing agent, 6 to 9 parts of foaming agent, and 40 to 70 parts of the aluminum oxide cladded silicon dioxide particles prepared by step 2; foaming at 50to 100 DEG C to prepare the nano-silicon polymerization heat insulation board. The nano-silicon polymerization heat insulation board is used for heat insulation of a building external wall and has a good flame-retarding effect.

Description

technical field [0001] The invention belongs to the technical field of building thermal insulation materials, and in particular relates to a nano-silicon polymerized thermal insulation board. Background technique [0002] On the basis of existing buildings, a large number of new buildings will be added every year in my country. Building energy consumption has accounted for a large proportion of the country's total energy consumption. Building energy conservation has become an important link in my country's sustainable development. Installing insulation boards on building exterior walls plays an important role in reducing building energy consumption. The materials of existing insulation boards can be divided into organic materials and inorganic materials; among them, extruded polystyrene board (XPS) or expanded polystyrene board (EPS) etc. are the most commonly used organic insulation materials, although organic materials have low thermal conductivity and Low density and oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/32C08K9/10C08K7/26C08K7/10C08G12/40C08J9/30
CPCC08G12/40C08J9/0038C08J9/0085C08J9/009C08J9/0095C08J9/30C08J2361/32C08K7/10C08K7/26C08K9/10C08K2201/011
Inventor 王文辉
Owner 廊坊暖康管业有限公司