A display substrate, its manufacturing method, and a display device
A technology for displaying substrates and substrates, which is applied in the manufacture of semiconductor devices, electrical solid state devices, and semiconductor/solid state devices. The number of carriers and the effect of improving the performance of display devices
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no. 1 example
[0039] This embodiment provides a display device, including: several unit light emitting devices (not shown in the figure) and a display substrate for supplying power to each unit light emitting device.
[0040] In one embodiment, the display device is configured as an organic light emitting display device, and its unit light emitting device includes an anode, an organic layer and a cathode. The organic layer includes a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer stacked on the anode in sequence. The cathode is arranged on the upper surface of the electron injection layer. The anode and the cathode provide holes and electrons to the organic layer, respectively. The electron-hole pairs recombine in the organic light-emitting layer to generate excitons, and the excitons transition from the excited state to the ground state, release energy, and emit light of the corresponding color. ...
no. 2 example
[0080] refer to Figure 11 as well as Figure 12 , this embodiment is similar to the technical solution of the first embodiment, the difference is that:
[0081] The materials of the first conductive layer 400 and the second conductive layer 600 are different. There is no first insulating layer 510 formed between the second conductive layer 600 and the first conductive layer 400 , that is, the plate region 610 is in direct contact with the gate region 410 , thereby realizing electrical connection.
[0082] The material of the first conductive layer 400 is different from that of the second conductive layer 600, and when the first insulating layer 510 is not formed between the second conductive layer 600 and the first conductive layer 400, it can prevent the second conductive layer 600 from being patterned and engraved. During etching, the first conductive layer 400 is also etched, thereby preventing the device performance from being affected. Specifically, in this embodiment...
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