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Manufacturing method of microfluidic chip

A technology of microfluidic chips and manufacturing methods, which is applied in fluid controllers, chemical instruments and methods, and laboratory containers, etc., which can solve the problems affecting the movement of liquid droplets, increasing the roughness of the dielectric layer, and the difficulty of liquid droplet movement, etc. question

Active Publication Date: 2021-03-02
SHANGHAI RENXING BIOTECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The above preparation steps are to prepare the dielectric layer and / or hydrophobic layer after forming the electrodes on the substrate. Regardless of the preparation method, this sequence will lead to a non-negligible gap between the electrodes, which will affect the droplet movement.
figure 1 Schematic diagram of chip structure for preparing dielectric layer by coating method (including spin coating, roll coating, spray coating, etc.) or deposition method (including physical sputtering, chemical vapor deposition, etc.), as shown in figure 1 As shown, the thickness of the dielectric layer is uniform and the formed electrodes can be completely attached. However, there is a gap between the electrodes on the dielectric layer, which increases the roughness of the dielectric layer and makes it difficult for the droplet to move.
figure 2 Schematic diagram of the chip structure for the preparation of the dielectric layer by the coating method, such as figure 2 As shown, the coating method is to attach the prepared film to the electrode, but there is a gap between the electrodes in the lower part of the dielectric layer, which produces tiny wavy steps, which hinders the movement of the liquid.

Method used

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  • Manufacturing method of microfluidic chip
  • Manufacturing method of microfluidic chip
  • Manufacturing method of microfluidic chip

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Embodiment 1

[0080] The first embodiment of the present invention provides a method for manufacturing a microfluidic chip, image 3 It is a schematic diagram of the hierarchical structure of the chip manufactured by the method of this embodiment; Figure 13 is the flow chart of the manufacturing method of the present embodiment;

[0081] like Figure 13 As shown, the manufacturing method of the microfluidic chip in this embodiment includes the following steps:

[0082] Step S1: Prepare a thin film as the dielectric layer 1. The purity, thickness, density and uniformity of the dielectric layer 1 directly determine whether the chip function can be realized. Therefore, the selection of the dielectric layer 1 is the most important and critical step in the entire chip manufacturing process. This embodiment uses Flexible film materials such as PVDF, PI, PET, PEN, PP, etc. or polymer films doped with various high dielectric constant impurities in these materials are used as the dielectric laye...

Embodiment 2

[0087] The second embodiment of the present invention provides a method for manufacturing a microfluidic chip, Figure 4 It is a schematic diagram of the level structure of the chip manufactured by the method of this embodiment; Figure 5 It is a schematic diagram of the hierarchical structure of the chip manufactured by the method of this embodiment. The second embodiment is a further improvement on the first embodiment, the main improvement is that, in the second embodiment of the present invention, see Figure 4-5 As shown, the circuit layer 2 formed in step S2 includes the electrode layer 21 and the wire layer 23 , and the electrode layer 21 and the wire layer 23 are in the same layer in the form of co-layering.

[0088] The electrode layer 21 is composed of two rows of single electrodes designed side by side. The distance between the single electrodes should be the minimum distance that can be achieved by the process used. Adjacent single electrodes cannot apply voltage...

Embodiment 3

[0091] The third embodiment of the present invention provides a method for manufacturing a microfluidic chip. Figure 6-8 It is a schematic diagram of the level structure of the chip manufactured by the method of this embodiment; Figure 9 It is a schematic diagram of the hierarchical structure of the chip manufactured by the method of this embodiment. The third embodiment is a further improvement on the first embodiment. The main improvement is that in the third embodiment of the present invention, in step S2, an electrode layer 21, an insulating layer 22 and wires are sequentially formed on the PI film. The layer 23, the electrode layer 21, the insulating layer 22, and the wire layer 23 collectively constitute the circuit layer 2 and are formed in a stacked form as a multilayer structure. see Image 6 As shown, the electrode layer 21 is composed of three rows and three columns of square single electrode arrays, and the horizontal and vertical distances between the electrod...

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Abstract

The invention provides a method for manufacturing a microfluidic chip, comprising the following steps: step S1: preparing a thin film as a dielectric layer; step S2: forming a circuit layer on the dielectric layer; step S3: converting the The thin film structure is combined with the reinforcement layer; step S4: coating a hydrophobic layer on the side of the thin film on which the circuit layer is not formed after step S3. The process of the invention is simple, the cost is reduced, and the produced microfluidic chip has good performance.

Description

technical field [0001] The invention relates to the field of microfluidic chips, in particular to a method for manufacturing a microfluidic chip. Background technique [0002] Microfluidics is a technology that precisely controls and manipulates microscale fluids, especially submicron structures, and has been developed in the directions of DNA chips, lab-on-a-chip, micro-sampling technology, and micro-thermodynamics technology. [0003] The microfluidic chip uses semiconductor-like micro-electromechanical processing technology to build a micro-fluidic system on the chip, and transfers the experiment and analysis process to the chip structure composed of interconnected paths and liquid phase chambers. After loading biological samples and reaction solutions, , using micromechanical pumps, electric hydraulic pumps, and electroosmotic flow to drive the flow of buffer in the chip to form a microfluidic path, and perform one or multiple reactions on the chip in succession. A vari...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L3/502792B01L2300/0645B01L2300/0887B01L2300/165B01L2400/0427
Inventor 胡丛余
Owner SHANGHAI RENXING BIOTECHNOLOGY CO LTD