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Polyimide-based block copolymer and polyimide-based film comprising same

一种嵌段共聚物、聚酰亚胺的技术，应用在涂层、仪器、光学等方向，能够解决差机械特性等问题

Active Publication Date: 2018-08-31
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, polyimide resins according to the proposal are difficult to exhibit sufficient heat resistance due to curved structures or aliphatic cyclic compounds, and films prepared using them still have limitations, such as poor mechanical properties

Method used

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  • Polyimide-based block copolymer and polyimide-based film comprising same
  • Polyimide-based block copolymer and polyimide-based film comprising same
  • Polyimide-based block copolymer and polyimide-based film comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0222] 4.851g (1.01 equivalent, 0.01515mol) 2,2'-bis(trifluoromethyl)benzidine, 2.665g (0.4 equivalent, 0.006mol) 4,4'-(hexafluoroisopropylidene)di-phthalate Diformic anhydride, 2.570g (0.5825 equivalent, 0.008738mol) 3,3',4,4'-biphenyltetracarboxylic dianhydride, 0.020g (0.005 equivalent, 0.000075mol) 1,3,5-benzenetricarbonyltri Chloride and 73ml of N,N-dimethylacetamide were placed in a 500ml round bottom flask equipped with a Dean-Stark apparatus and a condenser, and the mixture was stirred at 0°C under a nitrogen atmosphere for polymerization.

[0223] After 4 hours, 4.755 g (0.99 eq, 0.01485 mol) of 2,2'-bis(trifluoromethyl)benzidine, 1.553 g (0.51 eq, 0.00765 mol) of isophthaloyl dichloride were added to the polymerized product , 2.093g (0.5 equivalents, 0.0075mol) [1,1'-biphenyl]-4,4'-dicarbonyl dichloride and 66ml N,N-dimethylacetamide, and under nitrogen atmosphere at room temperature The mixture was stirred for 4 hours for polymerization.

[0224] To the polyamic a...

Embodiment 2

[0228] A polyimide-based copolymer (weight-average molecular weight: 600,000 g / mol) was obtained in the same manner as in Example 1, except that the content of the monomer in the polymerization reaction was changed to 0.944 g (0.31 equivalent, 0.00465 mol) isophthaloyl dichloride and 2.93 g (0.7 equivalents, 0.0105 mol) of [1,1'-biphenyl]-4,4'-dicarbonyl dichloride.

Embodiment 3

[0248] The copolymer obtained in Example 1 was dissolved in N,N-dimethylacetamide to prepare a polymer solution of about 25% (w / v). The polymer solution was poured on a glass plate, cast to a thickness of 335 μm using a film former, and dried with hot air at 80° C. for 10 minutes (repeated twice). It was then slowly heated from 100°C to 250°C for 2 hours while flowing nitrogen therein, kept at 250°C for 30 minutes, and then gradually cooled to obtain a film with a thickness of 30±2 μm after peeling off the glass plate.

[0249] Separately, a film having a thickness of 50±2 μm was obtained by the above method using the polymer solution.

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Abstract

The present invention relates to a polyimide-based block copolymer and a polyimide-based film comprising the same. The polyimide-based block copolymer according to the present invention makes it possible to provide a polyimide-based film exhibiting excellent mechanical properties while being colorless and transparent. The polyimide-based film can be appropriately used as a cover film of various flexible or foldable devices.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2016-0082990 filed with the Korean Intellectual Property Office on June 30, 2016 and Korean Patent Application No. 10-2017-0077971 filed with the Korean Intellectual Property Office on June 20, 2017 rights and interests, the disclosure of which is incorporated herein by reference in its entirety. [0003] The present disclosure relates to polyimide-based block copolymers and polyimide-based films comprising the same. Background technique [0004] Aromatic polyimide resins are polymers mainly having an amorphous structure, and exhibit excellent heat resistance, chemical resistance, electrical characteristics, and dimensional stability due to their rigid chain structure. Polyimide resins are widely used as electrical / electronic materials. [0005] However, the polyimide resin has many limitations in use because the polyimide resin is dark brown d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08G73/12C08G18/76C08L79/08C08J5/18
CPCC08G73/101C08G73/1039C08G73/1067C08G73/1085C08G73/14C08J5/18C08J2379/08C08L79/08C09D179/08G02B1/14C08G18/76C08G73/10C08G73/123
Inventor 崔珹裂金柄局金相坤张德训崔炯三
Owner LG CHEM LTD