A silicon wafer cleaning process

Abstract

The invention discloses a silicon wafer cleaning process, comprising a casing, an ultraviolet lamp tube is fixedly connected to the middle end of the inner cavity of the casing, and a heating wire is fixedly connected to the bottom of the inner cavity of the casing. The end is fixedly connected with a support plate, and the top end of the support plate is fixedly connected with a sleeve, the bottom of the inner cavity of the sleeve is movably connected with a scraper rod through a spring, and the top of the scraper rod is fixedly connected with a rubber plate. The middle end of the casing is movably installed with an adjusting wheel, the lower end of the left side of the casing is fixedly connected with a first support frame, and the left end of the inner surface of the first support frame is movably installed with a driven wheel. The silicon wafer cleaned by the process of the present invention has the advantages of good cleaning effect, fast cleaning rate, and continuous industrialized cleaning. At the same time, the drying device can effectively perform high-efficiency and energy-saving drying treatment on the cleaned silicon wafer. It is in line with the national energy conservation and emission reduction needs and the interests of the enterprise itself.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer cleaning process. Background technique [0002] Wafer thickness is a factor that affects productivity. It is related to the number of wafers produced per silicon block. Ultra-thin silicon wafers present additional challenges for wire saw technology, because their production is much more difficult. Except In addition to the mechanical brittleness of silicon wafers, if the wire saw process is not precisely controlled, tiny cracks and bends will have a negative impact on product yield. The ultra-thin silicon wafer wire saw system must be able to control process linearity, cutting line speed and pressure, and cutting cooling. Liquid is precisely controlled. [0003] Regardless of the thickness of the silicon wafer, manufacturers of crystalline silicon photovoltaic cells have put forward extremely high requirements for the quality of the silicon wafer...

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Problems solved by technology

[0002] Wafer thickness is a factor that affects productivity. It is related to the number of wafers produced per silicon block. Ultra-thin silicon wafers present additional challenges for wire saw technology, because their production is much more difficult. Except In addition to the mechanical brittleness of silicon wafers, if the wire saw process is not precisely controlled, tiny cracks and bends will have a negative impact on product yield. The ultra-thin silicon wafer wire saw system must be able to control process linearity, cutting line speed and pressure, and cutting cooling. Liquid for precise control

[0003] Regardless of the thickness of the silicon wafer, manufacturers of crystalline silicon photovoltaic cells have put forward extremely high requirements for the quality of the silicon wafer. Both) should be minimized, and the requirements for additional back-end processing such as polishing should also be minimized. Silicon wafers need to be cleaned before processing, but the cleaning effect of existing cleaning devices is not ideal, and the cleaning efficiency Low, can not carry out cleaning operations coherently, and at the same time, in the whole cleaning process, resources cannot be recycled, reducing the waste of resources, not only does not meet the needs of the country for energy conservation and emission reduction, but also does not meet the interests of the enterprise itself

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