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Thermally conductive molded resin article

A technology of thermal conductivity and resin molding, which is applied in the direction of semiconductor devices, heat exchange materials, semiconductor/solid device components, etc., can solve the problem of not fully satisfying heat dissipation characteristics, insufficient thermal conductivity, type or volume filling rate limitations, etc. Problems, to achieve low thermal resistance, reduce interface thermal resistance, reduce the effect of internal thermal resistance

Active Publication Date: 2018-09-04
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Furthermore, the types of thermally conductive fillers that can be used and their volume filling ratio are limited, so there is a problem that the obtained thermal conductivity is not sufficient, and the heat dissipation characteristics required by various electronic devices and the like cannot be fully satisfied.

Method used

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  • Thermally conductive molded resin article
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Examples

Experimental program
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Effect test

Embodiment 1

[0049] According to the preparation described in Table 1, a crosslinking agent and a thermally conductive filler were kneaded into the silicone resin component by twin rolls to obtain a strip-shaped sheet (composition as a precursor). "Silicone rubber DY32 1005U" manufactured by Toray Dow Corning Co., Ltd., flame retardant and plasticizer components were used as the silicone resin component, and "PT110" (plate-shaped boron nitride, average particle diameter of 45 μm) and “DAW-03” (aluminum oxide, average particle diameter of 3 μm) manufactured by Denka Co., Ltd. Furthermore, "RC-4" and "MR-53" manufactured by Toray Dow Corning Co., Ltd. were used as the crosslinking agent, and "ME-41F" manufactured by Momenntive was used as the flame retardant component containing metal compounds such as iron oxide. and "XC87-905". The plasticizer component is preferably a silicone oil having the same skeleton as the silicone rubber, requiring a viscosity of 100 cs to 10000 cs, and "KF-96-300...

Embodiment 2

[0058] As the thermally conductive filler, "XGP" (plate-like boron nitride, average particle size: 35 μm) and "DAW-03" (aluminum oxide, average particle size: 3 μm) manufactured by Denka Co., Ltd. were used. In the same manner, a thermally conductive resin sheet 2 was produced and evaluated. The results are shown in Table 1.

Embodiment 3

[0060] As the thermally conductive filler, "SGPS" (block boron nitride, average particle size: 12 μm) and "DAW-03" (aluminum oxide, average particle size: 3 μm) manufactured by Denka Co., Ltd. were used. In the same manner, a thermally conductive resin sheet 2 was produced and evaluated. The results are shown in Table 1.

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Abstract

Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance byhigh filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive moldedresin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5W / mK.

Description

technical field [0001] The present invention relates to a thermally conductive resin molded article, and more specifically, to a thermally conductive resin molded article that can be mass-produced at low cost and has excellent thermal conductivity in the thickness direction. Background technique [0002] With the rapid development of higher density and thinner electronic equipment, the influence of heat generated by integrated circuits (Integrated Circuit, IC) or power components, and high-brightness light-emitting diodes (Light Emitting Diode, LED) has become a major problem. In contrast, thermally conductive resin molded articles have come to be used as members that efficiently transfer heat between heat generating bodies such as chips and heat radiating bodies such as heat sinks. [0003] Here, as a method of imparting high thermal conductivity to a resin, a method of orientationally dispersing a thermally conductive filler in a resin is known in order to efficiently form...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K3/00C08L27/12C08L33/08
CPCC08K3/00C08L27/12C08L33/08C08L83/04C08K3/38C08K3/22C08K2201/001C08K2201/005C08K2201/016C08K2201/014C08K2003/382C08K2003/2227H01L23/3737H01L23/42H01L23/3731H01L23/3736H01L23/373C09K5/14C08K3/013C08L33/06C08L83/00H01L33/641
Inventor 向史博山浦考太郎内藤寛树迫康浩
Owner BANDO CHEM IND LTD
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