Silicon micro-cup type resonant gyro processing method based on polysilicon growth method

Abstract

The invention relates to a silicon micro-cup type resonant gyro processing method, and in particular relates to a silicon micro-cup type resonant gyro processing method based on a polysilicon growth method. The silicon micro-cup type resonant gyro processing method based on the polysilicon growth method disclosed by the invention solves the problem that a silicon micro-cup type resonant gyro processed through a deep silicon etching method is small in depth-to-width ratio and low in surface flatness. The silicon micro-cup type resonant gyro processing method based on the polysilicon growth method comprises the steps of: a, growing an Ith silicon nitride layer on the upper surface of a circular silicon substrate; b, etching the upper surface of the circular silicon substrate to form a circular concave cavity; c, removing the Ith silicon nitride layer and an IIth silicon nitride layer; d, growing a polysilicon layer on the surface of a silicon dioxide layer; e, etching to form an IIth circular window; f, re-growing a silicon dioxide layer; g, corroding a circular silicon convex platform; and h, corroding the exposed part of the silicon dioxide layer. The silicon micro-cup type resonant gyro processing method based on the polysilicon growth method disclosed by the invention is suitable for processing the silicon micro-cup type resonant gyro.

Description

technical field [0001] The invention relates to a processing method for a silicon microcup-shaped resonant gyroscope, in particular to a processing method for a silicon microcup-shaped resonant gyroscope based on a polysilicon growth method. Background technique [0002] Silicon microcup-shaped resonant gyroscope has good high-shock resistance characteristics, and it is widely used in weapon guidance, aerospace, biomedicine, consumer electronics and other fields. Under the current technical conditions, silicon microcup resonator gyroscopes are generally processed by deep silicon etching. However, due to the limitations of the deep silicon etching method, the processed silicon microcup resonator gyroscope generally has the problems of small aspect ratio and low surface smoothness, which limits the scope of application of the silicon microcup resonator gyroscope. . Based on this, it is necessary to invent a new processing method to solve the problems of small aspect ratio an...

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Problems solved by technology

[0003] In order to solve the problems of small aspect ratio and low surface smoothness of silicon microcup-shaped resonant gyroscope processed by deep si

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