Encapsulation substrate coding method, processing method and packaging substrate

Abstract

The invention relates to a coding method and a processing method of a package substrate and a package substrate. The coding method of the package substrate comprises the following steps: arranging a first substrate and a second substrate on the two surfaces of a bearing plate respectively; processing a first sub-plate on the first substrate, and processing a second sub-plate on the second substrate; and processing a preset number of first blind holes in the first sub-plate to form a first code, and processing a preset number of second blind holes in the second sub-plate to form a second code.The processing method comprises the coding method of the package substrate. The package substrate is processed by the processing method. During processing of the first code, the first blind holes areprocessed without penetrating the bearing plate. The processing way of the second code is the same as that of the first code. During subsequent sub-plate lamination, the bearing plate is not affected,so that a subsequent plate separation process is not hindered; separation is smoothly realized; damage is avoided; and the problems of incapability of reading and influence on tracking due to damageto the first code or the second code are solved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a coding method, a processing method and a packaging substrate for a packaging substrate. Background technique [0002] PCB (Printed Circuit Board), usually refers to circuit board, also known as printed circuit board or printed circuit board, is the carrier of electrical connection of electronic components. With the continuous development of the electronic industry, the product requirements for circuit boards are getting higher and higher, such as high performance, thinner and lower cost. The packaging substrate is a type of circuit board, and the packaging substrate can be processed in the form of a coreless substrate. Compared with the traditional circuit board, the coreless substrate removes the middle layer core board, only uses the insulating layer and copper layer to achieve high-density wiring by semi-additive extrusion process, which meets the requireme...

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Problems solved by technology

[0004] In order to meet the tracking and control requirements during packaging substrate processing, codes are usually printed during processing to identify the process or processing state of a certain allegro. In embedded circuit processing technology, traditional coding usually uses processing through holes It is easy to cause the insulating resin layer to enter the through hole and extend to the through hole at the position of the carrier board when the circuit sub-boards on both sides of the carrier board are subsequently pressed together. At this time, it is necessary to When the circuit sub-board is separated from the carrier board, due to the existence of insulating resin filled in the through hole, the circuit sub-board is not easy to peel off from the carrier board, resulting in the problem that the circuit sub-board is damaged during peeling, and the circuit sub-board is damaged Affects the coding recognition of the coding, resulting in the inability to track the package substrate normally during processing

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