Circuit carrier board and its manufacturing method
A manufacturing method and technology of circuit carrier boards, which are applied in the directions of circuits, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as bending or warping, reduce breakage or warping, improve flexibility, and prevent fractures. Effect
Active Publication Date: 2020-08-04
LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD +1
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Problems solved by technology
[0003] Generally, thin circuit boards are prone to bending or warping during the manufacturing process due to their thin thickness, and this problem is also prone to occur in the subsequent packaging process
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[0036] The following describes the technical solutions in the embodiments of the present invention clearly and completely with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0037] The orientation words "first" and "second" used herein are defined by the position of the first substrate when used, and are not limited.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used in the specification of the present invention herein is only for the purpose of describing specific embo...
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Abstract
A circuit support plate comprises an insulation layer, a conductive circuit layer, a conductive connection layer, a chip, a package layer and a welding ball, wherein the chip is arranged at one side of the insulation layer and is electrically connected with the conductive circuit layer, the welding ball is arranged at the other side of the insulation layer, the conductive circuit layer and the conductive connection layer both are buried in the insulation layer, the insulation layer is provided with a first surface and a second surface, the second surface is opposite to the first surface, an upper surface of the conductive connection layer is flush with a first surface of the insulation layer, and the insulation layer comprises a thermosetting corrosion-resistant material and has flexibility.
Description
Technical field [0001] The invention relates to a circuit carrier board, in particular to a thin bendable circuit carrier board and a manufacturing method thereof. Background technique [0002] Nowadays, in order to meet the diversified development of various electronic devices, circuit carrier boards have been widely used due to their advantages of lightness and thinness and high circuit density. [0003] Generally, the thin circuit carrier board is prone to bending or warping due to its thin thickness during the manufacturing process, and this problem is also likely to occur in the subsequent packaging process. Therefore, for thin circuit carriers, how to avoid bending or warping during the manufacturing process is particularly important. Summary of the invention [0004] In view of this, the present invention provides a circuit carrier with a thinner thickness and high process yield and a manufacturing method thereof. [0005] A circuit carrier board includes an insulating layer,...
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IPC IPC(8): H01L23/498H01L23/528
CPCH01L23/49816H01L23/49838H01L23/528H01L2224/16225H01L2924/181H01L2924/00012
Inventor 黄昱程
Owner LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD