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A Method for Rapidly Adjusting the Impedance Matching of Plasma Discharge

A technology of impedance matching and plasma, applied in the direction of discharge tubes, circuits, electrical components, etc., can solve problems such as difficult, difficult to commercialize, and low efficiency, and achieve the effect of short matching adjustment time and low cost

Active Publication Date: 2022-06-28
SUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a method for quickly adjusting the impedance matching of plasma discharge, and solve the technical problems in the prior art that the impedance matching price is higher, the efficiency is low, the difficulty is large, and it is difficult to commercialize

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  • A Method for Rapidly Adjusting the Impedance Matching of Plasma Discharge
  • A Method for Rapidly Adjusting the Impedance Matching of Plasma Discharge
  • A Method for Rapidly Adjusting the Impedance Matching of Plasma Discharge

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Embodiment Construction

[0040] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.

[0041] The method for rapidly adjusting the impedance matching of plasma discharge provided by the present invention combines the theory of energy transmission and impedance matching in radio frequency microwaves and the physical mechanism of plasma discharge, predicts and calculates the matching state by means of software simulation, and adjusts the components according to actual conditions. The parameters of the matching box are reasonably designed, so as to quickly adjust the impedance matching during the plasma discharge experiment, as follows:

[0042] Draw Smith chart: Use the S-parameter control in the ADS software to set the frequency sweep range of the S-parameter according ...

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Abstract

The invention discloses a method for quickly adjusting the impedance matching of plasma discharge, combining the energy transmission and impedance matching theory in radio frequency microwave and the physical mechanism of plasma discharge, predicting and calculating the matching state through ADS software simulation, according to The parameters of the actual adjustment components are reasonably designed for the matching box, so that the impedance matching can be quickly adjusted during the plasma discharge experiment. The invention has short matching adjustment time, low cost and universal applicability, can provide adjustment and matching guidance schemes for all discharge conditions, and provides a development direction for automatic matching technology.

Description

technical field [0001] The invention relates to a method for rapidly adjusting the impedance matching of plasma discharge. Background technique [0002] Low temperature plasma is a non-equilibrium plasma with high electron temperature and ion temperature close to normal temperature. In recent years, the high-tech industry based on low temperature plasma technology is developing rapidly. For example, technologies such as plasma etching, sputtering, and film deposition are widely used in the cleaning and processing of semiconductor devices; in the pollution control industry, new three-waste treatment technologies using corona discharge, dielectric barrier discharge and other methods have also emerged; In the fields of metallurgy, steel and other fields, plasma technology is also an important surface treatment method, which can improve the hardness, wear resistance and corrosion resistance of metal surfaces. The reason why low temperature plasma has such a wide range of appli...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/20H01J37/32
CPCH01J37/32G06F30/20
Inventor 葛鸿宇胡一波吴雪梅
Owner SUZHOU UNIV