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Coil part

A technology of coil components and coils, which is applied in coil manufacturing, transformer/inductor components, electric components, etc., and can solve problems such as reducing heat dissipation characteristics

Inactive Publication Date: 2018-10-26
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this coil component, when the resin molded body covering the coil has a large size, voids are more likely to be generated during molding of the resin molded body, which degrades heat dissipation characteristics

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0026] Embodiments of the present invention will be described below with reference to the drawings. Note that the drawings described in the following embodiments are schematic diagrams, and the dimensional ratio of each component does not necessarily correspond to the actual dimensional ratio.

[0027] (Example)

[0028] figure 1 A is a plan view showing the coil component 1 of this embodiment, figure 1 B is a front view showing the coil component 1, figure 2 The A is along the figure 1 A cross-sectional view of line A-A of B, and figure 2 The B is along the figure 1 A cross-sectional view of line B-B of A. In the following description, figure 1 The up-down direction in B is defined as the first direction D1, figure 1 The left-right direction in B is defined as the second direction D2, and figure 1 The up-down direction in A is defined as a third direction D3. The arrows representing the first direction D1 , the second direction D2 and the third direction D3 in the...

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PUM

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Abstract

Provided is a coil part capable of improving heat dissipation. The coil part (1) is provided with two coils (2), two first mold parts (3), and a second mold part (5). The two first mold parts (3) haveelectrical insulation, and cover the two coils (2) individually. The second mold part (5) has electrical insulation, and integrally covers the two first mold parts (3). The modulus of elasticity of the second mold part (5) is less than the respective moduli of elasticity of the two first mold parts (2).

Description

technical field [0001] The present invention relates generally to coil components, and more particularly to a coil component including a coil covered with a molded body. Background technique [0002] A coil component (reactor) including a coil covered with a resin molded body is known (for example, see Patent Document 1). The coil component described in Patent Document 1 includes two coils integrally covered with a resin molded body. [0003] In this coil component, when the resin molded body covering the coil has a large size, voids are more likely to be generated during molding of the resin molded body, which degrades heat dissipation characteristics. [0004] reference list [0005] patent documents [0006] Patent Document 1: JP 2012-134562 A Contents of the invention [0007] In view of the above circumstances, an object of the present invention is to provide a coil component capable of improving heat dissipation characteristics. [0008] A coil component accordi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/02H01F27/00H01F41/04
CPCH01F27/022H01F27/324H01F27/327H01F37/00H01F27/255H01F2027/406H01F27/02H01F27/32H01F41/0246H01F41/12H01F2017/048H02K15/12
Inventor 小谷淳一朝日俊行松谷伸哉长崎宽范
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD