Display substrate mother board and preparation method and cutting method thereof, display substrate and display device
A technology for displaying substrates and cutting methods, applied in lamination devices, identification devices, chemical instruments and methods, etc., can solve the problems of short laser pulse time, short laser wavelength, and inability to adapt to the narrow frame process requirements of display substrates, and achieve Control the cutting line width and reduce the effect of cutting line width
Active Publication Date: 2018-10-30
BOE TECH GRP CO LTD
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Problems solved by technology
The laser wavelength of UV laser is short, and the laser pulse time is short, which can reduce the cutting line width to a certain extent, but the cutting line width is still between 100 μm and 150 μm
Therefore, the line width of the existing laser cutting is relatively wide, which cannot meet the technological requirements of the narrow frame of the display substrate.
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[0050] Typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the description and drawings therein are illustrative in nature and not intended to limit the present disclosure. public.
[0051] In the following description of various exemplary embodiments of the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of example, various exemplary structures, systems, which may implement aspects of the present disclosure and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of...
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The invention provides a display substrate mother board and a preparation method and cutting method thereof, a display substrate and a display device. The display substrate mother board comprises backfilm, an adhesive layer, a substratum substrate, a display device layer and protective film which are arranged stackedly, wherein the adhesive layer comprises a first adhesive layer and second adhesive layers adjacently arranged at the two sides of the first adhesive layer respectively, the first adhesive layer corresponds to a preset cutting position of the display substrate mother board, a light blocking layers are arranged among the first adhesive layer and the second adhesive layers, and the light blocking layers are configured to reduce light rays incident from the first adhesive layer after entering into the second adhesive layers through the light blocking layers decrease. The display substrate mother board has the advantages that in a cutting technology, when cutting light rays are incident from the portion above the first adhesive layer, the light blocking layers can reduce the incident cutting light rays after entering the second adhesive layers through the light blocking layers, that is, the influence of the cutting light rays on the second adhesive layers is reduced, thereby achieving the effect of controlling the width of cutting lines.
Description
technical field [0001] The present disclosure relates to the technical field of display devices, and in particular to a display substrate mother board, a preparation method and a cutting method thereof, a display substrate and a display device. Background technique [0002] The display substrate motherboard is a multi-layer film structure. The existing display substrate motherboard usually includes film layers such as protective film, display layer, base substrate, and back film. After the above film layer process is completed, the display substrate motherboard needs to be used Laser cutting. The line width of laser cutting directly affects the frame width of the display substrate. [0003] Existing laser cutting light sources mainly include two types, namely carbon dioxide (CO 2 ) laser and UV laser. CO 2 The laser mainly relies on thermal melting to realize the cutting of the film layer, and the cutting line width is usually greater than 200 μm. The laser wavelength o...
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IPC IPC(8): G09F9/30B23K26/38
CPCG09F9/30B23K26/38G02F1/133351G02F1/133512G02F1/133553B32B7/12B32B2307/416B32B7/023B32B2457/20B32B2307/58B32B37/12B32B37/182B32B38/0004B32B2310/0843
Inventor 刘陆蔡宝鸣杜双
Owner BOE TECH GRP CO LTD