Display substrate mother board and its preparation method and cutting method, display substrate and display device
A technology for a display substrate and a cutting method, which is applied to identification devices, lamination devices, chemical instruments and methods, etc., can solve the problems of short laser pulse time, short laser wavelength, and cannot meet the requirements of the narrow frame process of display substrates, etc. The effect of controlling the cutting line width and reducing the cutting line width
Active Publication Date: 2020-04-24
BOE TECH GRP CO LTD
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Problems solved by technology
The laser wavelength of UV laser is short, and the laser pulse time is short, which can reduce the cutting line width to a certain extent, but the cutting line width is still between 100 μm and 150 μm
Therefore, the line width of the existing laser cutting is relatively wide, which cannot meet the technological requirements of the narrow frame of the display substrate.
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[0050] Typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the description and drawings therein are illustrative in nature and not intended to limit the present disclosure. public.
[0051] In the following description of various exemplary embodiments of the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of example, various exemplary structures, systems, which may implement aspects of the present disclosure and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of...
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The present disclosure proposes a display substrate mother board and its preparation method and cutting method, a display substrate and a display device. The display substrate mother board includes a stacked back film, an adhesive layer, a base substrate, a display device layer and a protective film. Wherein, the adhesive layer includes a first adhesive layer and a second adhesive layer adjacent to the first adhesive layer, the first adhesive layer corresponds to the preset cutting position of the display substrate motherboard, the first adhesive layer and the second adhesive layer A light-blocking layer is arranged between the layers, and the light-blocking layer is configured so that the incident light from the first adhesive layer is reduced after entering the second adhesive layer through the light-blocking layer. The disclosure can make the cutting process of the display substrate motherboard, when the cutting light is incident from above the first adhesive layer, the light-blocking layer can reduce the incident cutting light after entering the second adhesive layer through the light-blocking layer, that is, reduce cutting. The effect of light on the second adhesive layer, so as to achieve the effect of controlling the cutting line width.
Description
technical field [0001] The present disclosure relates to the technical field of display devices, and in particular to a display substrate mother board, a preparation method and a cutting method thereof, a display substrate and a display device. Background technique [0002] The display substrate motherboard is a multi-layer film structure. The existing display substrate motherboard usually includes film layers such as protective film, display layer, base substrate, and back film. After the above film layer process is completed, the display substrate motherboard needs to be used Laser cutting. The line width of laser cutting directly affects the frame width of the display substrate. [0003] Existing laser cutting light sources mainly include two types, namely carbon dioxide (CO 2 ) laser and UV laser. CO 2 The laser mainly relies on thermal melting to realize the cutting of the film layer, and the cutting line width is usually greater than 200 μm. The laser wavelength o...
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IPC IPC(8): G09F9/30B23K26/38
CPCG09F9/30B23K26/38G02F1/133351G02F1/133512G02F1/133553B32B7/12B32B2307/416B32B7/023B32B2457/20B32B2307/58B32B37/12B32B37/182B32B38/0004B32B2310/0843
Inventor 刘陆蔡宝鸣杜双
Owner BOE TECH GRP CO LTD