A kind of organosilicon modified high temperature resistant pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof
A technology of high temperature resistance and silicone, applied in the field of pressure-sensitive adhesives, can solve problems such as difficult to achieve high temperature resistance, poor chemical structure uniformity, prone to residual glue or ghosting, etc., to improve stability and leveling, initial Good viscous performance, the effect of improving the initial tack performance
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Embodiment 1
[0027] A high-temperature-resistant pressure-sensitive adhesive with excellent performance and a pressure-sensitive adhesive tape using the pressure-sensitive adhesive, the preparation process of which is as follows:
[0028] 1) Synthesis of acrylic acid-2-octyl-1-dodecyl monomer
[0029] Dissolve 90 parts of 2-octyldodecanol and 25 parts of acrylic acid in 100 parts of dichloromethane, add 9 parts of 4-dimethylaminopyridine and 9 parts of 1-(3-bis Methylaminopropyl)-3-ethylcarbodiimide hydrochloride, the temperature was controlled at 20°C, and the reaction was carried out for 90 hours to prepare 2-octyldodecyl acrylate in Example 1.
[0030] 2) Synthesis of Silicone Modified High Temperature Pressure Sensitive Adhesive
[0031] According to the mass parts of raw materials, 80 parts of acrylate-2-octyldodecyl, 5 parts of acrylic acid, 10 parts of N-hydroxyethyl acrylamide, 8 parts of polyester-modified polydimethylsilane containing acrylic acid functional groups Oxygen, 0.00...
Embodiment 2
[0035] A high-temperature-resistant pressure-sensitive adhesive with excellent performance and a pressure-sensitive adhesive tape using the pressure-sensitive adhesive, the preparation process of which is as follows:
[0036] 1) Synthesis of acrylic acid-2-octyl-1-dodecyl monomer
[0037] Dissolve 75 parts of 2-octyldodecanol and 25 parts of acrylic acid in 90 parts of dichloromethane in parts by mass of raw materials, add 8 parts of 4-dimethylaminopyridine and 8 parts of 1-(3-di Methylaminopropyl)-3-ethylcarbodiimide hydrochloride, the temperature was controlled at 25°C, and the reaction was carried out for 80 hours to prepare Example 2-2-octyldodecyl acrylate.
[0038] 2) Synthesis of Silicone Modified High Temperature Pressure Sensitive Adhesive
[0039] According to the mass parts of raw materials, 70 parts of acrylate-2-octyldodecyl, 12 parts of acrylic acid, 5 parts of N-hydroxyethyl acrylamide, 7 parts of polyester-modified polydimethylsilane containing acrylic acid fu...
Embodiment 3
[0043] A high-temperature-resistant pressure-sensitive adhesive with excellent performance and a pressure-sensitive adhesive tape using the pressure-sensitive adhesive, the preparation process of which is as follows:
[0044] 1) Synthesis of acrylic acid-2-octyl-1-dodecyl monomer
[0045] Dissolve 60 parts of 2-octyldodecanol and 20 parts of acrylic acid in 60 parts of dichloromethane in parts by mass of raw materials, add 5 parts of 4-dimethylaminopyridine and 5 parts of 1-(3-di Methylaminopropyl)-3-ethylcarbodiimide hydrochloride, the temperature was controlled at 30°C, and the reaction was carried out for 50 hours to prepare 2-octyldodecyl acrylate in Example 3.
[0046] 2) Synthesis of Silicone Modified High Temperature Pressure Sensitive Adhesive
[0047] According to the mass parts of raw materials, 50 parts of acrylate-2-octyldodecyl, 5 parts of acrylic acid, 12 parts of N-hydroxyethyl acrylamide, 3 parts of polyester-modified polydimethylsiloxane containing acrylic ac...
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