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Improved atomization spraying structure

An improved atomization spray technology, applied in the direction of final product manufacturing, circuit, climate sustainability, etc., can solve the problems of poor cleaning effect of silicon wafer atomization spray device, and achieve the improvement of spray pressure and mist. the effect of reducing the amount of use

Active Publication Date: 2018-11-02
EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the technical problem of the poor cleaning effect of the silicon chip atomization spray device in the prior art, the present invention provides an improved atomization spray structure

Method used

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  • Improved atomization spraying structure
  • Improved atomization spraying structure
  • Improved atomization spraying structure

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Embodiment Construction

[0019] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0020] Such as Figure 4-7 As shown, it is the best embodiment of the present invention, an improved atomized spray structure, including a long spray pipe 1, a first inner pipe 2 and a second inner pipe 3, and the upper side of the long spray pipe 1 is arranged in the middle There is a main inlet 11, and the bottom of the long spray pipe 1 is provided with a plurality of uniform main outlet holes 12 along the length direction of the long spray pipe 1. The first inner pipe 2 and the second inner pipe 3 are both arranged on the long spray pipe 1. Inside, the axes of the first inner pipe 2 and the second inner pipe 3 are parallel to the length direction of the l...

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Abstract

The invention relates to the technical field of solar cell silicon wafer production equipment, in particular to an improved atomization spraying structure. A first inner pipe and a second inner pipe are arranged inside a spraying long pipe, so that existing spraying pressure and atomization capacity are improved, some smudges adhered to the surfaces of silicon wafers can be cleaned preferably, andthe using amount of a liquid medium is reduced.

Description

technical field [0001] The invention relates to the technical field of solar cell silicon wafer production equipment, in particular to an improved atomizing spray structure. Background technique [0002] Silicon wafer, also known as "chip", integrated circuit block. A silicon chip usually contains a circuit composed of tens to tens of thousands of silicon transistors to complete one or several functions. Silicon wafers need to be cleaned and dried during the production process, and existing silicon wafer atomization spraying devices (such as Figure 1-3 As shown), when atomizing and spraying silicon wafers, the liquid enters from the inlet 6, and a row of uniform small holes 7 at the lower end sprays out. There is no flow equalization structure inside, resulting in the liquid volume and pressure at both ends of the sprayed liquid. The output volume and pressure are smaller than those in the middle, and the spraying is uneven, which affects the cleaning effect of silicon waf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L31/18
CPCH01L31/1804H01L21/67051Y02E10/547Y02P70/50
Inventor 吴佳俊张凯胜姚伟忠孙铁囤
Owner EGING PHOTOVOLTAIC TECHNOLOGY CO LTD