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A laser positioning tile cutting equipment

A cutting equipment, laser positioning technology, applied in stone processing equipment, work accessories, manufacturing tools, etc., can solve the problem of inconvenient collection of tile cutting and cutting products, and achieve the effect of preventing equipment damage

Active Publication Date: 2020-08-18
苏州莱铯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a laser positioning tile cutting equipment, which solves the problem of inconvenient collection of tile cutting products

Method used

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  • A laser positioning tile cutting equipment
  • A laser positioning tile cutting equipment
  • A laser positioning tile cutting equipment

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Such as Figure 1-5 As shown, the present invention provides a laser positioning tile cutting equipment, including a cutting table 1, the right side of the top of the cutting table 1 is welded with a fixed plate 2, the left side of the top of the cutting table 1 is welded with a baffle 3, the fixed plate 2 and the baffle The top of the front of the plate 3 is fixedly connected with a crossbeam 4 by bolts, the bottom of the left side of the fixed plate 2...

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Abstract

The invention provides laser positioning ceramic tile cutting equipment and relates to the field of laser cutting equipment. The equipment comprises a cutting table, the top of the front face of a fixing plate and the top of the front face of a baffle are fixedly connected with a cross beam through bolts, a laser emitter is arranged at the bottom of the left side of the fixing plate, and a cuttinghead is arranged on the outer side of the cross beam; a handle is fixedly connected to the left side of the cutting head, and an anti-collision mechanism is arranged in the middle of the bottom of the handle; lug plates are welded to the tops and the bottoms of the two sides of the front side of the cutting table, and a folding mechanism is movably connected between the two lug plates through clamping bolts. Due to the cooperation of the cutting table, the fixing plate, the baffle, the cross beam, the handle, a buffer block, a buffer groove, a buffer plate, a limiting column and a buffer spring, the problem that the anti-collision function of the cutting equipment is relatively poor is solved. Through the cooperation of supporting legs, lifting grooves, movable blocks, a storage plate andmagnetic blocks, the problem that a traditional cutting method is inconvenient to use during ceramic tile cutting and collecting is solved.

Description

technical field [0001] The invention relates to the technical field of laser cutting equipment, in particular to a laser positioning ceramic tile cutting equipment. Background technique [0002] Ceramic tiles, also known as tiles, are a kind of acid and alkali resistant porcelain or stone formed by refractory metal oxides and semi-metal oxides through the process of grinding, mixing, pressing, glazing and sintering. Or decorative materials, called ceramic tiles, its raw materials are mostly mixed with clay, quartz sand, etc. [0003] At present, ceramic tiles are used in building construction and home decoration, but when laying tiles, due to the uncertainty of the surface area and actual operation conditions, the laying of tiles may not be complete. For cutting, the current existing technology generally adopts the method of cutting knife to cut the tiles. This cutting method is purely manual operation. When cutting, due to manual operation, the cutting will be uneven and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22B28D7/00B28D7/04
CPCB28D1/22B28D7/00B28D7/04
Inventor 杨丁中
Owner 苏州莱铯科技有限公司