Curing resin composition and transparent conductive film
A transparent conductive film, curing resin technology, applied in conductive coatings, coatings, polyurea/polyurethane coatings, etc., can solve the problem of low adhesion of metal nanowires and carbon nanotubes, low total light transmittance, and high haze problem, to achieve the effect of high production efficiency, high total light transmittance, and low haze
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preparation example Construction
[0090]The preparation method of the cured resin composition provided by the invention is: dissolving the ionizing radiation curing reactive matrix into a solvent, adding carbon nanotubes and silver nanowires after stirring, adding a leveling agent and a photoinitiator after stirring, and curing after stirring resin composition.
[0091] The preparation method of the transparent conductive film provided by the invention is as follows: coating the cured resin composition on the surface of the base material, drying, and then curing with an ultraviolet lamp to form a transparent conductive layer.
[0092] The test method of the main performance of transparent conductive film provided by the invention is as follows:
[0093] (1) Coating thickness test
[0094] Use the coating thickness gauge ETA-SST thickness testing system to test the thickness of the transparent conductive layer by using the principle of light diffraction.
[0095] (2) Haze, total light transmittance test
[0...
Embodiment 1
[0117] The present invention provides a cured resin composition and a transparent conductive film. The cured resin composition includes an ionizing radiation curing reactive matrix; a photoinitiator; carbon nanotubes; metal nanowires; the transparent conductive film includes a substrate 20 and Transparent conductive layer 10 (such as figure 1 shown), the conductive layer includes resin, carbon nanotubes and metal nanowires; the carbon nanotubes and metal nanowires are bonded to the surface of the substrate by resin; the conductive layer is coated with a cured resin composition, formed after curing. The formula of curing resin composition is as follows:
[0118]
[0119] 5.1kg of aliphatic urethane acrylate oligomer (manufactured by China Taiwan Changxing Chemical Industry Co., Ltd., trade name: Etercure 6195-100) and 1.5kg aliphatic polyurethane diacrylate oligomer (China Taiwan Changxing Chemical Industry Co., Ltd. Co., Ltd., trade name: Etercure 611A-85) was dissolved i...
Embodiment 2
[0122] The cured resin composition and transparent conductive film provided in Example 1.
[0123] The formula of curing resin composition is as follows:
[0124]
[0125] 4kg of aliphatic urethane acrylate oligomer (manufactured by China Taiwan Double Bond Chemical Co., Ltd., trade name: Doublemer 5812) and 3.1kg tripropylene glycol diacrylate (manufactured by China Taiwan Changxing Chemical Industry Co., Ltd., trade name: EM 223) was dissolved in 15.5kg of toluene and 5.0kg of isopropanol mixed solvent, after stirring for 20 minutes, add 0.31kg carbon nanotubes (length 20 μm, diameter 20nm), 0.48kg silver nanowires (length 30 μm, diameter 60nm) , after stirring for 20 minutes, then add 0.03kg of leveling agent with polydimethylsiloxane skeleton structure (manufactured by BYK Chemicals; trade name: BYK-377) and 0.33kg of photoinitiator (China Taiwan Double Bond Chemical Co., Ltd. Co., Ltd., trade name: Doublecure 184), after stirring for 30 minutes, a cured resin composit...
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Abstract
Description
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