Computer central processor heat dissipation device combining phase change materials and liquid cooling

Abstract

The invention relates to a computer central processor heat dissipation device combining phase change materials and liquid cooling. A water pump layer is disposed inside the lower part of a base; a heat passage layer is disposed inside the middle part of the base; the heat passage layer communicates with the water pump layer through a water pump mouth; a water pump fan is disposed inside the waterpump layer; a heat passage plate is disposed on the heat passage layer; the heat passage layer is provided with a V-shaped baffle plate and a heat passage layer base groove; one side of the V-shaped baffle plate is provided with a cooling liquid outlet, and the other side is provided with a cooling liquid inlet; the heat passage plate is composed of a dense cooling fin, a phase change material layer and a heat conduction metal plate; the dense cooling fin is fixed on the heat conduction metal plate through the phase change material layer; a phase change material accommodating cavity is disposed inside the phase change material layer; and the heat passage plate is embedded in the heat passage layer base groove through a heat passage sealing rubber ring and is sealingly connected with the heat passage layer. In the computer central processor heat dissipation device, the phase change materials are responsible for achieving limitation on the maximum temperature of an electronic component;a cooling liquid system is responsible for timely and efficiently taking away heat from the phase change materials and the electronic component; a temperature control effect is obvious; and the installation and maintenance are convenient.

Description

Technical field [0001] The invention relates to a heat dissipation device for electronic components, in particular to a heat dissipation device for a computer central processing unit that adopts phase change material / liquid cooling to release heat and absorb heat. Background technique [0002] The CPU is the core component of the computer, responsible for all the calculation and control operations of the computer, and is the main source of heat for the computer. Temperature is the main factor that affects the performance of the CPU. Excessive temperature will cause the stability of the CPU to decrease, and it may even be damaged. Therefore, the temperature of the computer's CPU must be controlled to ensure the safe and efficient operation of the computer. [0003] Traditional CPU radiators include air-cooled and water-cooled. The air-cooled radiator has a simple structure and low cost, but its cooling efficiency is low and the fan is noisy. The water-cooled radiator takes away th...

AI Technical Summary

Problems solved by technology

However, when the usage rate of the CPU is high, its temperature will rise rapidly, and it is difficult to take away the heat on the CPU in time by relying on the circulating flow of the fluid alone, thereby affecting the working state of the CPU. It is a must to quickly take away the heat on the CPU serious problem

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