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Coaxially packaged optical module and coaxially packaged laser

A technology of lasers and optical components, applied in the field of high-speed optical communication, to achieve the effect of accurate measurement value and good linear relationship

Pending Publication Date: 2018-11-09
SUZHOU YIRUI OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a coaxial packaged optical component and a coaxial packaged laser, which solves the need for forward output optical power monitoring when using an electroabsorption modulation chip in a coaxial package

Method used

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  • Coaxially packaged optical module and coaxially packaged laser
  • Coaxially packaged optical module and coaxially packaged laser
  • Coaxially packaged optical module and coaxially packaged laser

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Embodiment 1 5

[0031] The following embodiments are mainly aimed at a coaxial packaged optical component, the light emitting chip of which is an electro-absorption modulation chip (EML), and a certain proportion of the emitted light of the EML chip is coupled to the detector chip by using a spectroscopic device, and the rest of the light is Output as signal light from the emission window of the coaxial package assembly. Finally, by measuring the photocurrent signal coupled to the detector chip, the proportional relationship between the photocurrent and the output optical power can be obtained.

Embodiment 1

[0033] See figure 1 , the coaxial packaged optical assembly shown in this embodiment includes a laser assembly 1-1, a spectroscopic device 1-2, and a detector assembly 1-3, wherein the laser assembly 1-1 includes a chip substrate 1-11 and is arranged on a chip The laser chip 1-12 on the substrate 1-11, the detector assembly 1-3 includes a detector substrate 1-31 and a detector chip 1-32 arranged on the detector substrate 1-31, and the spectroscopic device 1- 2 is arranged on the side of the emitting end of the laser chip 1-12, and the detector chip 1-32 is optically coupled with the optical splitting device 1-2 to monitor the forward optical power of the coaxial packaged optical component.

[0034] In this embodiment, the laser chip 1-12 is an EML chip, the detector chip 1-32 is a monitoring photodiode, and the beam splitting device 1-2 includes a beam splitting diaphragm 1-21 and a support member 1-22, and the beam splitting diaphragm 1-21 is fixed on the support 1-22. The ...

Embodiment 2

[0036] See figure 2 , the coaxial packaged optical assembly shown in this embodiment includes a laser assembly 2-1, a spectroscopic device 2-2, and a detector assembly 2-3, wherein the laser assembly 2-1 includes a chip substrate (not shown) and an arrangement The laser chip 2-12 on the chip substrate, the detector assembly 2-3 includes a detector substrate (not shown) and a detector chip 2-32 arranged on the detector substrate, and the spectroscopic device 2-2 is set On the side of the emitting end of the laser chip 2-12, the detector chip 2-32 is optically coupled with the optical splitting device 2-2 to monitor the forward optical power of the coaxial packaged optical component.

[0037] In this embodiment, the laser chip 2-12 is an EML chip, the detector chip 2-32 is a monitoring photodiode, and the beam splitting device 2-2 includes a beam splitting diaphragm 2-21 and a support (not shown), and the beam splitting The membrane 2-21 is fixed on this support. The beam-spl...

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Abstract

The invention relates to a coaxially packaged optical module and a coaxially packaged laser. The coaxially packaged optical module comprises a laser module, a light splitter, and a detector module, the laser module comprises a chip substrate and a laser chip arranged on the chip substrate, the detector module comprises a detector substrate and a detector chip arranged on the detector substrate, the light splitter is arranged on one side of the emitting end of the laser chip, and the detector chip is coupled with the light path of the light splitter to monitor the forward light power of the coaxially packaged optical module. According to the coaxially packaged optical module and the coaxially packaged laser, the light splitter is arranged between the laser module and the detector module tosplit emitted light, the monitoring device is then utilized to monitor the forward light power of the coaxially packaged optical module, and thereby the requirement of the usage of an electroabsorption modulation chip in coaxial packaging on forward output light power monitoring is met.

Description

technical field [0001] The invention relates to a coaxial packaged optical component and a coaxial packaged laser, belonging to the field of high-speed optical communication. Background technique [0002] The development of high-speed optical communication technology meets the modern society's demand for massive data transmission, based on the application and development of high-speed optical communication technology, big data, cloud storage and other technologies. Coaxial packaging is a mature packaging technology. With the rapid increase of data transmission volume, the coaxial packaging technology is mature. However, due to the expansion of the transmission network, the increase in the demand for output optical power at the transmitter, and the upgrade of the transmission rate, the solution is Improve the optical power of the chip device at the transmitting end, optimize the coupling design of the optical path, and reduce the differential loss. The transmission rate of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/026G02B6/42
CPCH01S5/026G02B6/4286G02B6/4296G02B6/4263
Inventor 郑睿刘恭志
Owner SUZHOU YIRUI OPTOELECTRONICS TECH CO LTD