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Mask and manufacturing method thereof

A manufacturing method and mask technology, which are applied in semiconductor/solid-state device manufacturing, ion implantation plating, coating, etc., can solve the problems of low mask precision and difficulty in opening a net

Pending Publication Date: 2018-11-13
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention at least partly solves the problems of low precision of the existing mask board and difficulty in stretching the net, and provides a high-precision mask board and a manufacturing method thereof that are easy to realize the step of stretching the net

Method used

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  • Mask and manufacturing method thereof
  • Mask and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 As shown in FIG. 6, this embodiment provides a method for manufacturing a mask plate, including:

[0030] S10, such as figure 1 As shown, photoresist is coated on the first surface 11 and the second surface 12 of the hard material substrate 10 .

[0031] Wherein, the first surface 11 of the substrate 10 mentioned here is opposite to the second surface 12 . Before coating the photoresist on the first surface 11 and the second surface 12, the surface of the substrate 10 should be cleaned to eliminate impurities on the surface of the substrate 10, thereby forming a uniform photoresist layer. The hard material is a material with high hardness. Specifically, the hardness of the substrate 10 of the hard material should be greater than that of the subsequent metal material.

[0032] A preferred hard material substrate 10 is a silicon substrate 10 .

[0033] Wherein, the activity of the silicon substrate is poor compared with metal, so in the following step...

Embodiment 2

[0068] Such as Figure 6a and Figure 6b shown, where Figure 6b for Figure 6a In the cross-sectional structure diagram at A-A, this embodiment provides a mask made by the method of Embodiment 1, including a mask body and a support structure 15 connected to the mask body.

[0069] Wherein, the mask plate body is provided with openings 21, and the openings 21 are distributed in multiple regions, and there are interval regions without openings 21 between adjacent regions, and the multiple regions can be distributed in an array. The size of each opening 21 in any direction may be 2um to 10um, and the distance between adjacent openings 21 is 3um to 6um. The mask plate can be made of metal, such as Ni or Cu.

[0070] Wherein, the support structure 15 is located in the spacer on one side of the mask, which is used to increase the mechanical strength of the mask and avoid the break of the mask during the stretching process. The supporting structure 15 is made of a hard material...

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Abstract

The invention provides a mask and a manufacturing method thereof and belongs to the technical field of displaying. The problems of low precision and difficult net stretching of existing masks can be at least partially solved. The manufacturing method of the mask comprises the steps that under protection of a first mask pattern, etching is conducted on a first surface of a base plate made of hard materials, a pattern comprising a plurality of microcolumns is formed, wherein the surface, without microcolumns, of the base plate formed after etching is a third surface, the microcolumns are corresponding to openings of the mask, all the microcolumns are distributed in a plurality of composition areas, and interval areas without microcolumns are formed between adjacent composition areas. A metallayer is formed on the third surface, and the hardness of the hard materials is higher than that of the metal layer. Under protection of a second mask pattern, etching is conducted on a second surface opposite to the first surface of the base plate, all parts of the base plate are removed except reserved areas, thus the metal layer forms a mask body with openings, and the left parts in the reserved areas of the base plate form support structures located in the interval areas and connected with the mask body.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a mask plate and a manufacturing method thereof. Background technique [0002] Active-matrix organic light emitting diodes (Active-matrix organic light emitting diode, AMOLED) devices can be used as display panels. In the production process, the evaporation process step affects the yield the most. The basic process of the evaporation process is: organic materials evaporated by heating and materials such as cathodes are evaporated on the glass substrate through the opening of the high-precision metal mask (FMM) to form a light-emitting structure. Since the mask is the key to affect the pixel density (Pixels PerInch, PPI) of the AMOLED device, it is very important to improve its precision through the manufacturing process of the mask. [0003] In the high-precision metal mask in the prior art, the metal material is wet-etched to form openings required for evaporation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04H01L51/56C25D5/02C25D5/54
CPCC23C14/042C25D5/02C25D5/54H10K71/166
Inventor 王慧娟董学王瑞勇陈敏琪魏从从
Owner BOE TECH GRP CO LTD