A method for through-hole reflow soldering
A welding surface and spot welding technology, applied in the direction of assembling printed circuits with electrical components, to achieve the effects of high welding quality and reliability, ensuring welding quality, and simple and convenient operation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0041] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0042] Such as figure 1 As shown, the present invention provides a method for through-hole reflow soldering, which is carried out according to the following steps:
[0043] S1, determine the connector and the through hole on the corresponding PCB board;
[0044] S2, use manual welding to seal the through hole corresponding to the welding surface of the PCB board by spot welding;
[0045] S3, return the solder paste to the temperature and stir evenly, and then use the pusher to push the solder paste into the through hole after spot welding in step S2;
[0046] S4, inserting the connector...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


