A fool-proof method and system for preventing pcb board solder resistance deviation

Abstract

The invention provides a fool-proof method for preventing the resistance welding deviation of PCBs. The fool-proof method comprises the steps that target square boxes are arranged in target areas of the initial PCBs with different expanding and shrinkage coefficients correspondingly; according to the expanding and shrinkage coefficients of the initial PCBs, the initial PCBs are classified to obtain a plurality of initial PCB sets; according to the expanding and shrinkage coefficients, the targets of the initial PCBs in the PCB sets are moved from the initial position to the target position, and a to-be-exposed PCB set containing a plurality of to-be-exposed PCBs is obtained; an automatic exposure machine selects corresponding exposure film coefficients according to the expanding and shrinkage coefficient of the to-be-exposed PCB set; according to the exposure film coefficients, a corresponding film tool is matched; and the automatic exposure machine judges whether the target positionsof the targets in the to-be-exposed PCBs in the to-be-exposed PCB set are the same as the positions of film targets in the film tool or not. According to the fool-proof method for preventing the resistance welding deviation of the PCBs, the phenomenon of the resistance welding deviation of the different PCBs in the resistance welding process is effectively prevented, and the economic loss, causedby the deviation, of PCB materials is avoided.

Description

technical field [0001] The invention relates to the field of printed circuits, in particular to a fool-proof method and system for preventing PCB board solder resistance offset. Background technique [0002] With the increasingly refined development of PCB circuit boards, customers have higher and higher requirements for the alignment accuracy of solder mask exposure of PCB boards. In the actual production process, the size of the circuit board substrate is affected by temperature / material / process, and there are different degrees of expansion and contraction. In order to avoid PCB deformation and scrapping due to drilling / pattern mismatch. Therefore, after pressing each PCB, a coefficient is calculated by measuring the machine, and the coefficient is marked on the edge of the control board. PCB boards with different coefficients require corresponding tools to be used in the process of image transfer alignment exposure. Therefore, during the image transfer of the solder mask...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, one of the purposes of the present invention is to provide a fool-proof method for preventing the deviation of the solder resistance of the PCB board, which can solve the problem of a certain type of PCB board mixed with a small amount of other types of PCBs in the actual operation process. Board, solder mask is produced using a coefficient film tool to cause the phenomenon of deviation

[0004] The second purpose of the invention is to provide a fool-proof system for preventing the offset of PCB board soldering, which can solve the problem that a certain type of PCB board is mixed with a small amount of other types of PCB boards in the actual operation process, and a coefficient film is used for soldering resistance. The problem of misalignment caused by tool production

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