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Silicone resin composition for die bonding, die bonding material, and optical semiconductor device

A silicone resin and composition technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced brightness and easy yellowing of the resin, and achieve high adhesiveness, high hardness, high reliability, and excellent adhesion. Effect

Active Publication Date: 2021-04-30
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the sealing material and die-bonding material made of epoxy resin are applied to blue LEDs emitting short-wavelength light and white LEDs using the blue LEDs, there are following problems in durability. Strong ultraviolet rays cause the resin to easily turn yellow, which leads to a decrease in brightness, etc.

Method used

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  • Silicone resin composition for die bonding, die bonding material, and optical semiconductor device
  • Silicone resin composition for die bonding, die bonding material, and optical semiconductor device
  • Silicone resin composition for die bonding, die bonding material, and optical semiconductor device

Examples

Experimental program
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Effect test

Embodiment 1

[0149] 75 parts by mass of the aforementioned (A-1) were dissolved in xylene, and 25 parts by mass of the aforementioned (B-1) and 0.1 parts by mass of dibutylhydroxytoluene were mixed. A viscous liquid was obtained by distilling off xylene from the obtained liquid mixture at 90° C. under reduced pressure of 10 mmHg or less. For 100 parts by mass of this viscous liquid, mix 3.4 parts by mass of 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1 part by mass of ethynylmethyldecane Carbitol, and 18.8 parts by mass of the aforementioned (C-1), a transparent liquid mixture was obtained. To this liquid mixture, with respect to the total amount of (A-1), (B-1) and (C-1), 12 ppm of the above-mentioned (E-1) was added in terms of mass of platinum, and 2.4 parts by mass of the above-mentioned (F-1), 1 part by mass of (F-2), 12 parts by mass of REOLOSIL DM30S (manufactured by Tokuyama Corporation) and 0.4 parts by mass of (D) were stirred and mixed to prepare a silicone resin ...

Embodiment 1

[0152] For Example 1, except using 25 parts by mass of the aforementioned (B-2) to replace 25 parts by mass of the aforementioned (B-1), and using 12 parts by mass of the aforementioned (C-2) to replace 18.8 parts by mass of the aforementioned (C-1) Besides, a silicone resin composition was prepared in the same procedure as in Example 1.

[0153] The mole of this composition represented by {the total amount of SiH groups in the aforementioned (C-2) component} / {the total amount of Si-vinyl groups in the aforementioned (A-1) component and the aforementioned (B-2) component} The ratio is 1.0.

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Abstract

The problem to be solved by the present invention is to provide a silicone resin composition useful for die bonding, which can obtain a cured product with excellent product reliability, and the cured product has good adhesion and high hardness. In order to solve the above problems, the present invention is a silicone resin composition for crystal bonding, which is characterized in that it contains the following components: (A) a three-dimensional network organopolysiloxane resin of the following formula (1), which is Waxy or solid at 23°C, (R 2 3 SiO 1 / 2 ) a (R 1 R 2 2 SiO 1 / 2 ) b (R 1 R 2 SiO) c (R 2 2 SiO) d (R 1 SiO 3 / 2 ) e (R 2 SiO 3 / 2 ) f (R 3 SiO 3 / 2 ) g (SiO 4 / 2 ) h (1); (B) linear organopolysiloxane, with vinyl, CH in one molecule 2 =CH‑COO‑(CH 2 ) m ‑Base and CH 2 =C(CH 3 )‑COO‑(CH 2 ) m One or more of the groups; (C) an organosilicon compound having two or more Si-H in one molecule; (D) an organic peroxide; (E) a platinum group metal catalyst.

Description

technical field [0001] The present invention relates to a silicone resin composition for crystal bonding, a crystal bonding material composed of the composition, and an optical semiconductor device having a cured product of the crystal bonding material. Background technique [0002] Conventionally, epoxy resins have been used for sealing materials and die-bonding materials for light-emitting diode (LED) elements (that is, adhesives for bonding dies of LED elements and the like to substrates such as packages). Especially in the die-bonding material, if the resin is too soft, the problem of not being able to bond the die in the wire bonding process after the die-bonding process has occurred. Therefore, as this die-bonding material, high-hardness adhesives have been gradually used in the past. That is epoxy resin. [0003] However, when the sealing material and die-bonding material made of epoxy resin are applied to blue LEDs emitting short-wavelength light and white LEDs usin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/42H01L33/56
CPCH01L33/56C08G77/42C08L83/04C08G77/12C08G77/20C08G77/08C08K5/14
Inventor 朝仓爱里小林之人
Owner SHIN ETSU CHEM IND CO LTD