Package structure of ball grid array, and package method thereof

Abstract

The invention provides a package structure of a ball grid array, and a package method thereof. The package method comprises the steps that a base plate is provided, and a first area, a second area anda third area which are used for arranging welded balls are at least arranged on the surface of one side of the base plate; and one or more first welded balls are welded to the first area, one or moresecond welded balls are welded to the second area, one or more third welded balls are welded to the third area, wherein one or more parameters of the first welded balls, the second welded balls and the third welded balls are different, and the parameters comprise heat conduction performance, the thermal expansion coefficient and the size. According to the package structure of the ball grid array,and the package method thereof, the multiple welding areas are defined on the lower portion of the base plate, one or more welded balls with the different parameters are welded to each welding area,and the parameters comprise the heat conduction performance and the size; and in this way, the welded balls with the different parameters can be welded according to the specific demands of each welding area, and thus the oval performance of the package structure of the ball grid array is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure of a ball grid array and a packaging method thereof. Background technique [0002] Ball Grid Array (BGA for short) packaging technology is a surface mount technology applied to integrated circuits. This technology is often used to permanently fix devices such as microprocessors. The BGA package can provide more pins than others such as Dual in-line package or Quad Flat Package, and the bottom surface of the entire device can be used as pins , instead of only being used around the surrounding area, it can also have a shorter average wire length than the surrounding package type, so as to have better high-speed performance; the BGA package is to make an array on the bottom of the package substrate, and the solder balls are used as the circuit. The I / O terminal is interconnected with the printed circuit board (PCB). [0003] Solder balls have ...

AI Technical Summary

Problems solved by technology

The larger the solder ball, the stronger the thermal conductivity, but at the same time, the larger the solder ball, the larger the substrate area occupied, which is contrary to the high-density and high-pin output of the BGA; and, due to the substrate, the printed circuit board and the metal solder ball The difference in expansion coefficient is relatively large. Under the condition of thermal expansion and contraction, the larger the solder ball after the substrate is packaged, the larger the metal area between the back of the substrate and the printed circuit board, and the greater the shear stress generated. Breakage of solder joints leading to solder balls

However, if relatively small solder balls are used, on the one hand, it is not conducive to the heat conduction of the functional chips in the package, and on the other hand, the solder balls at the four corners of the package are easy to break when dropped and collided.

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