A protection structure and its manufacturing method, and an organic light-emitting display device
A technology for protecting structures and substrates, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems affecting the performance and life of organic light-emitting display devices, poor heat dissipation capacity of the foam layer, etc., to avoid the heat dissipation capacity. Poor, reducing the effect of attaching bubbles and improving heat dissipation
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[0027] As mentioned in the background art, the existing foam layer has poor heat dissipation capability, which will affect the performance and lifespan of the organic light emitting display device. The inventor found that the existing foam layer is formed by directly spraying the foaming agent on the base material. Different foaming agents have different formulas from different manufacturers, and the impact resistance of the foam produced is different, but the same thing is that the foam produced The heat dissipation capacity of the foam is relatively poor.
[0028] Based on this, the present invention provides a kind of protection structure, to overcome the above-mentioned problem that prior art exists, comprise:
[0029] The base material and the first foam layer located on the surface of the base material; the first foam layer includes a heat conduction layer, and the heat conduction layer is a grid structure.
[0030] The present invention also provides a method for makin...
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