Riveting jig for improving alignment degree between PCB riveting layers
A riveting fixture and alignment technology, which is applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve problems such as increased production difficulty, and achieve the goals of reducing rework rate, improving quality, and increasing utilization rate Effect
Inactive Publication Date: 2018-11-23
奥士康精密电路(惠州)有限公司
View PDF3 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
But correspondingly, the difficulty of its production has also been greatly increased, especially in how to improve the interlayer alignment of multilayer boards.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] The technical solutions of the present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings, but the protection scope and implementation methods of the present invention are not limited thereto.
[0025] In a specific embodiment, the front view, side view and top view of a riveting jig for improving the alignment between PCB riveting layers of the present invention are as follows Figure 1~3 As shown, the riveting fixture includes a fixture bracket 1, a pin positioning hole 2 opened on the fixture bracket 1, and a pin 3 implanted in the pin positioning hole;
[0026] Wherein, the material of the jig support 1 is a CCL substrate with a thickness of 1.2-1.5 mm.
[0027] Four pin positioning holes 2 with a diameter of 3.16 mm are set in the middle of the periphery of the jig support 1 near the edge; at the same time, the edge of the jig support 1 has a circle 10 corresponding to the edge of the inner layer o...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a riveting jig for improving alignment degree between PCB riveting layers. The jig comprises a jig support (1), pin positioning holes (2) which are formed in the jig support (2), and pins (3) which are implanted in the pin positioning holes. By virtue of the riveting jig, the alignment degree between the PCB riveting layers can be effectively improved, so that the quality of the PCB multi-layer board can be improved, the reworking rate of riveting is reduced, the production bottleneck of the PCB multi-layer board is dredged, the riveting capacity of the large-batch board is improved, and the production efficiency is improved; no obstruction or other inconvenience is caused to the normal operation action of the operator, and the production efficiency is not influenced; it is ensured that the adverse influence, such as scratching and the like, on a brown film caused by the jig is avoided by attaching a scratch-resistant material; the service life of the jig is effectively prolonged; meanwhile, the riveting jig breaks through the existing two-point positioning riveting and pre-stack design on a riveting machine, and four-point positioning and the offline pre-stack of the multi-layer plate are realized; and the riveting jig is simple and easy to manufacture.
Description
technical field [0001] The invention relates to the technical field of PCB production, in particular to a riveting jig for improving the alignment between PCB riveting layers. Background technique [0002] With the development of the market economy, the price competition of PCB production is becoming more and more fierce. In an environment where material costs, labor costs, environmental protection costs, and energy costs continue to increase, major PCB manufacturers are facing a severe test of "life and death". In order to increase the output area per unit time as much as possible under the premise of a reasonable equipment utilization rate, major PCB manufacturers have proposed to increase the size of the cutting material and increase the demand for a single output area. But correspondingly, its production difficulty has also been greatly increased, especially in how to improve the interlayer alignment of multilayer boards. How to ensure product quality under the premise...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 梁波贺波蒋善刚何高强
Owner 奥士康精密电路(惠州)有限公司