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Electronic equipment

A technology for electronic equipment and circuit boards, applied in the field of communications, can solve the problems of increasing the thickness of electrical components, increasing the difficulty of assembly, and adversely affecting the development of electronic equipment, and achieve the effect of reliable grounding

Active Publication Date: 2018-11-23
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the installation of metal wires makes the circuit design too complicated, and there are many factors to consider, which increases the difficulty of design; the installation of conductive foam increases the thickness between electrical components and increases the difficulty of assembly, which is not conducive to the direction of thinner and lighter electronic equipment. development, it is also not conducive to improving assembly efficiency and yield

Method used

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Embodiment Construction

[0014] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0015] The casing assembly is a part of the electronic equipment, which includes a middle frame (front casing), a storage space in the enclosed area of ​​the middle frame, and various electrical components accommodated in the storage space. Every electrical component has a grounding requirement. The inventors of the present application have found that if a grounding structu...

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Abstract

The invention provides electronic equipment. The electronic equipment includes a housing, a circuit board, a metal fastener and a sound cavity box, wherein the housing includes a ground bearing surface; the circuit board includes exposed copper surfaces, the exposed copper surfaces and the sound cavity box are electrically connected, the exposed copper surfaces are fixed on the ground bearing surface through the metal fastener. The electronic equipment includes the circuit board and the sound cavity box, the sound cavity box and the circuit board are electrically connected, and the sound cavity box and the circuit board are relatively fixed on the ground bearing surface through the metal fastener, so that the sound cavity box and the circuit board can be reliably grounded at the same time.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to an electronic device. Background technique [0002] At present, various electrical components installed in electronic devices such as mobile phones and tablet computers need to be reliably grounded. The usual practice is to provide conductive structures between the electrical components and the grounding point, such as metal wires, conductive foam, etc. [0003] However, the installation of metal wires makes the circuit design too complicated, and there are many factors to consider, which increases the difficulty of design; the installation of conductive foam increases the thickness between electrical components and increases the difficulty of assembly, which is not conducive to the direction of thinner and lighter electronic equipment. Development is also not conducive to improving assembly efficiency and yield. Contents of the invention [0004] The present application...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05F3/02
CPCH05F3/02H05K9/0064H05K9/0067
Inventor 张恒严慎波袁永亮
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD