Epoxy resin composite material and preparation method thereof
An epoxy resin and composite material technology, applied in the field of polymer materials, can solve the problems of reduced mechanical strength, reduced strength and toughness, and high brittleness of sheet molding compounds.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0025] A method for preparing an epoxy resin composite material in an embodiment includes the following steps S110-S130:
[0026] S110, mixing the epoxy resin, the toughening modifier, the surfactant, the foaming agent and the flame retardant to obtain a premix.
[0027] Among them, 100 parts by mass of epoxy resin, 10-30 parts by mass of toughening modifier, 3-5 parts by mass of surfactant, 1-10 parts by mass of foaming agent, and 20-40 parts by mass of flame retardant share.
[0028] Further, the toughening modifier is selected from at least one of polyether polyurethane resin, polyester polyurethane resin and acrylic resin.
[0029] Wherein, the polyether polyurethane resin is tetrahydrofuran polyether polyurethane (molecular weight: 1000).
[0030] Further, the surfactant is a polyethylene glycol type surfactant.
[0031] Further, the blowing agent is at least one selected from azodicarbonamide, 2,2'-azobisisobutyronitrile, diethyl azodicarboxylate, azoaniline and benze...
Embodiment 1
[0055] Mix 100kg epoxy resin E51, 10kg acrylic resin, 4kg polyethylene glycol, 1kg 2,2'-azobisisobutyronitrile, 8kg DOPO, 2kg hydroxyl-terminated polysiloxane and 10kg aluminum hydroxide to obtain a premix .
[0056] The premixed material was added from the main feeding port of the single-screw extruder, 10 kg of glass fiber and 20 kg of polyetheramine D400 were added from the side feeding port, and extruded from the die by a screw to obtain a blended material. Wherein, the extrusion temperature of the single-screw extruder is 40° C., and the residence time is 4 minutes; the die head temperature is 55° C., and the residence time is 2 minutes.
[0057] The blended material is heated and cured in a high-temperature oven to obtain an epoxy resin composite material. Among them, the high-temperature drying tunnel is a two-stage heating tunnel with hot air circulation. The temperature of the front drying tunnel is 75°C, and the residence time is 19 minutes; the temperature of the r...
Embodiment 2
[0059] 100kg epoxy resin E51, 30kg tetrahydrofuran polyether polyurethane (molecular weight 1000), 4kg polyethylene glycol, 10kg 2,2'-azobisisobutyronitrile, 7kg PEPA, 3kg hydroxyl-terminated polysiloxane and 30kg hydrogen Alumina is mixed to obtain a premix.
[0060] The premixed material was added from the main feeding port of the single-screw extruder, 40kg of glass fiber and 50kg of polyamide 650 were added from the side feeding port, and extruded from the die by a screw to obtain a blended material. Wherein, the extrusion temperature of the single-screw extruder is 50° C., and the residence time is 5 minutes; the die head temperature is 60° C., and the residence time is 3 minutes.
[0061] The blended material is heated and cured in a high-temperature oven to obtain an epoxy resin composite material. Among them, the high-temperature drying tunnel is a hot air circulation two-stage heating drying tunnel. The temperature of the front drying tunnel is 80°C, and the residenc...
PUM
| Property | Measurement | Unit |
|---|---|---|
| density | aaaaa | aaaaa |
| density | aaaaa | aaaaa |
| density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com


