Heat-conducting insulation casting glue

A technology of heat conduction insulation and potting glue, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as poor insulation performance, and achieve the effects of improving insulation performance, improving fluidity, and improving performance

Inactive Publication Date: 2018-11-30
FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main technical problem to be solved by the present invention is to provide a thermally conductive and insulating potting compound for the

Method used

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  • Heat-conducting insulation casting glue

Examples

Experimental program
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Effect test

Example Embodiment

[0028] Example 1

[0029] Mix the active silicon powder with water in a mass ratio of 1:20, and ultrasonically disperse it for 25 minutes under the condition of a frequency of 55 kHz to obtain a silicon powder dispersion. Mix the silicon powder dispersion with a silane coupling agent in a mass ratio of 10:3. After stirring and mixing for 60 minutes at a temperature of 45 °C and a rotation speed of 600 r / min, a pretreated silicon powder dispersion was obtained, and the pretreated silicon powder dispersion and the block copolymer were mixed in a beaker at a mass ratio of 10:3, To the beaker, add 0.12 times the mass of the pretreated silicon powder dispersion liquid butanol, 0.08 times the mass of the pretreated silicon powder dispersion liquid, and 0.03 times the mass of the pretreated silicon powder dispersion liquid. Sodium dodecyl sulfate, at the temperature After stirring and mixing for 60 minutes at a temperature of 50 °C and a rotation speed of 400 r / min for 60 minutes, fi...

Example Embodiment

[0030] Example 2

[0031] The active nano-alumina and anhydrous ethanol are mixed in a four-necked flask in a mass ratio of 1:28, and ethyl orthosilicate with 3 times the mass of active nano-alumina and 0.4 times the mass of active nano-alumina are added to the four-necked flask. The silane coupling agent of 12 mL / min was poured into the four-necked flask, and nitrogen was introduced into the four-necked flask at a temperature of 45 °C and a rotating speed of 400 r / min. After stirring and mixing for 40 minutes, an alumina mixture was obtained. Under the condition of nitrogen, dropwise add ammonia water with a mass fraction of 25% to the alumina mixture at a rate of 3 mL / min, and stir for 5 h at a temperature of 45 °C and a rotation speed of 350 r / min. Then, vacuum filtration to obtain the pretreated filler, after washing the pretreated filler with anhydrous ethanol for 8 times, and drying it for 40 min at a temperature of 70 °C, the filler is obtained, and the filler and isocy...

Example Embodiment

[0032] Example 3

[0033]Mix the active silicon powder with water in a mass ratio of 1:20, and ultrasonically disperse it for 25 minutes under the condition of a frequency of 55 kHz to obtain a silicon powder dispersion. Mix the silicon powder dispersion with a silane coupling agent in a mass ratio of 10:3. After stirring and mixing for 60 minutes at a temperature of 45 °C and a rotation speed of 600 r / min, a pretreated silicon powder dispersion was obtained, and the pretreated silicon powder dispersion and the block copolymer were mixed in a beaker at a mass ratio of 10:3, To the beaker, add 0.12 times the mass of the pretreated silicon powder dispersion liquid butanol, 0.08 times the mass of the pretreated silicon powder dispersion liquid, and 0.03 times the mass of the pretreated silicon powder dispersion liquid. Sodium dodecyl sulfate, at the temperature After stirring and mixing for 60 minutes at a temperature of 50 °C and a rotation speed of 400 r / min for 60 minutes, fil...

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Abstract

The invention discloses a heat-conducting insulation casting glue, belongs to the technical field of high polymer material. According to the heat-conducting insulation casting glue, A component materials are weighted in sequence in parts by weight: 50 to 80 parts of mixed epoxy resin, 12 to 20 parts of ethylene glycol diglycidyl ether, 10 to 15 parts of a modified toughening agent, 2 to 4 parts ofa dispersing agent, 1 to 3 parts of an antiforming agent, 10 to 20 parts of carbon black, 12 to 20 parts of modified inorganic filler; B component materials are weighted in sequence in parts by weight: 40 to 60 parts of hexahydro-4-methylphthalic anhydride,10 to 12 parts of dibutyl phthalate, 2 to4 parts of a dispersing agent, 1 to 3 parts of an antiforming agent and 1 to 2 parts of an accelerant. The A component materials and the B component materials are mixed and stirred, and are packaged respectively to obtain the heat-conducting insulation casting glue. The heat-conducting insulation casting glue prepared by the invention has excellent heat-conduct performance and insulation performance and has a broad prospect in the development of high polymer material industry.

Description

technical field [0001] The invention discloses a thermally conductive and insulating potting glue, which belongs to the technical field of polymer materials. Background technique [0002] Potting glue, used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. There are many types of electronic potting adhesives. In terms of material types, the most commonly used are three types, namely epoxy resin potting adhesives, silicone resin potting adhesives, and polyurethane potting adhesives. Sealant can be subdivided ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
CPCC08K2003/2227C08K2201/011C08L2205/025C08L2205/06C09J11/04C09J163/00C08L63/00C08K13/06C08K9/10C08K3/22C08K3/04C08K3/36
Inventor 胡次兵刘侠宋宇星
Owner FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
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