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Heat-conducting insulation casting glue

A technology of heat conduction insulation and potting glue, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as poor insulation performance, and achieve the effects of improving insulation performance, improving fluidity, and improving performance

Inactive Publication Date: 2018-11-30
FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main technical problem to be solved by the present invention is to provide a thermally conductive and insulating potting compound for the disadvantages of poor thermal conductivity and poor insulation performance of the traditional thermally conductive and insulating potting compound.

Method used

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  • Heat-conducting insulation casting glue

Examples

Experimental program
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Effect test

example 1

[0029] Mix active silicon micropowder and water at a mass ratio of 1:20, and ultrasonically disperse at a frequency of 55kHz for 25 minutes to obtain a silicon micropowder dispersion. Mix the silica micropowder dispersion with a silane coupling agent at a mass ratio of 10:3. After stirring and mixing for 60 minutes at a temperature of 45°C and a rotational speed of 600r / min, the pretreated microsilica powder dispersion was obtained, and the pretreated microsilica powder dispersion and the block copolymer were mixed in a beaker at a mass ratio of 10:3. And add the butanol of 0.12 times of quality of pretreatment silicon micropowder dispersion liquid in the beaker, the organic solvent of 0.08 times of quality of pretreatment silicon micropowder dispersion liquid and the sodium lauryl sulfate of 0.03 times of quality of pretreatment silicon micropowder dispersion liquid, at temperature After stirring and mixing for 60 minutes at 50°C and a rotating speed of 400r / min, filter to obt...

example 2

[0031] Mix active nano-alumina and absolute ethanol in a four-necked flask at a mass ratio of 1:28, and add orthosilicate ethyl 3 times the mass of activated nano-alumina and 0.4 times the mass of activated nano-alumina to the four-necked flask silane coupling agent, nitrogen gas was passed into the four-necked flask at a rate of 12mL / min, and the temperature was 45°C, and the rotation speed was 400r / min. After stirring and mixing for 40min, the alumina mixture was obtained. Under the condition of nitrogen, add dropwise ammonia water with a mass fraction of 25% of 0.4 times the mass of the alumina mixture to the alumina mixture at a rate of 3mL / min, and stir for 5 hours at a temperature of 45°C and a rotation speed of 350r / min. Afterwards, vacuum filtration to obtain the pretreated filler, which was washed 8 times with absolute ethanol, and dried for 40 minutes at a temperature of 70°C to obtain the filler, and the filler and isocyanate were mixed in a mass ratio of 1:4 In a f...

example 3

[0033]Mix active silicon micropowder and water at a mass ratio of 1:20, and ultrasonically disperse at a frequency of 55kHz for 25 minutes to obtain a silicon micropowder dispersion. Mix the silica micropowder dispersion with a silane coupling agent at a mass ratio of 10:3. After stirring and mixing for 60 minutes at a temperature of 45°C and a rotational speed of 600r / min, the pretreated microsilica powder dispersion was obtained, and the pretreated microsilica powder dispersion and the block copolymer were mixed in a beaker at a mass ratio of 10:3. And add the butanol of 0.12 times of quality of pretreatment silicon micropowder dispersion liquid in the beaker, the organic solvent of 0.08 times of quality of pretreatment silicon micropowder dispersion liquid and the sodium lauryl sulfate of 0.03 times of quality of pretreatment silicon micropowder dispersion liquid, at temperature After stirring and mixing for 60 minutes at 50°C and a rotating speed of 400r / min, filter to obta...

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Abstract

The invention discloses a heat-conducting insulation casting glue, belongs to the technical field of high polymer material. According to the heat-conducting insulation casting glue, A component materials are weighted in sequence in parts by weight: 50 to 80 parts of mixed epoxy resin, 12 to 20 parts of ethylene glycol diglycidyl ether, 10 to 15 parts of a modified toughening agent, 2 to 4 parts ofa dispersing agent, 1 to 3 parts of an antiforming agent, 10 to 20 parts of carbon black, 12 to 20 parts of modified inorganic filler; B component materials are weighted in sequence in parts by weight: 40 to 60 parts of hexahydro-4-methylphthalic anhydride,10 to 12 parts of dibutyl phthalate, 2 to4 parts of a dispersing agent, 1 to 3 parts of an antiforming agent and 1 to 2 parts of an accelerant. The A component materials and the B component materials are mixed and stirred, and are packaged respectively to obtain the heat-conducting insulation casting glue. The heat-conducting insulation casting glue prepared by the invention has excellent heat-conduct performance and insulation performance and has a broad prospect in the development of high polymer material industry.

Description

technical field [0001] The invention discloses a thermally conductive and insulating potting glue, which belongs to the technical field of polymer materials. Background technique [0002] Potting glue, used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. There are many types of electronic potting adhesives. In terms of material types, the most commonly used are three types, namely epoxy resin potting adhesives, silicone resin potting adhesives, and polyurethane potting adhesives. Sealant can be subdivided ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
CPCC08K2003/2227C08K2201/011C08L2205/025C08L2205/06C09J11/04C09J163/00C08L63/00C08K13/06C08K9/10C08K3/22C08K3/04C08K3/36
Inventor 胡次兵刘侠宋宇星
Owner FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
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