A test method for bonding strength between laser cladding layer and substrate
A technology of laser cladding and testing method, which is applied in the direction of strength characteristics, using stable tension/pressure test material strength, measuring device, etc., to achieve the effect of convenient operation and easy realization
Active Publication Date: 2020-02-21
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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However, due to the minimum size requirement of the tensile specimen, multi-layer laser cladding is required, and the document has 40 layers of laser cladding, which is not feasible for conventional laser single-layer or several-layer cladding
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[0029] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0030] The present disclosure provides a method for testing the bonding strength of a laser cladding layer and a substrate, including:
[0031] Make a circular sample, which includes the substrate and the laser cladding layer on the substrate;
[0032] A first hole is formed on the substrate, the first hole is a circular hole coaxial with the circular sample, and the depth of the circular hole is equal to the thickness of the substrate;
[0033] A plurality of second holes are formed on the substrate, the plurality of second holes are symmetrical to the first hole, and the center distances between each second hole and the first hole are Δ;
[0034] Connect the pump to the round hole through the pipeline, start the pu...
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Abstract
The invention provides a test method for the bonding strength of a laser cladding layer and a matrix. The method includes: making a circular sample, which includes a matrix and a laser cladding layeron the matrix; forming a first hole on the matrix, wherein the first hole is a circular hole and is coaxial with the circular sample, and has a depth equal to the thickness of the matrix; forming a plurality of second holes on the matrix, wherein the plurality of second holes are symmetric about the first hole, and center distances of all the second holes to the first hole are all Delta; connecting a pump to the circular hole through a pipeline, starting the pump for pressurization to a certain value till pressure oscillation, beginning separation of the laser cladding layer and the matrix, and determining the pressure P1 of the moment; when the laser cladding layer and the matrix are separated to the plurality of second holes, declining the pressure instantaneously, and determining the pressure P2 of the moment; and according to the pressure P1, the pressure P2, the circular hole diameter and the center distance Delta, calculating the bonding strength of the laser cladding layer and the matrix. The method provided by the invention can quantitatively acquire the bonding strength of the laser cladding layer and the matrix.
Description
technical field [0001] The disclosure belongs to the technical field of laser processing, in particular to a method for testing the bonding strength of a laser cladding layer and a substrate. Background technique [0002] As a surface modification technology, laser cladding technology is increasingly used in surface strengthening and remanufacturing of parts. Compared with the thermal spraying method, the bonding strength between the cladding layer and the substrate obtained by laser cladding is high, and the tensile strength cannot be tested by the adhesive method. Usually, the metallographic observation method is used to judge whether the cladding layer and the substrate are metallurgically bonded. Quantitatively test the binding strength value. The literature (Liu Luzhao, Research on the influence of molten pool shape on bonding performance in laser repair [D], University of Chinese Academy of Sciences, 2013) discloses a method for testing the bonding strength of laser c...
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IPC IPC(8): G01N3/08
CPCG01N3/08G01N2203/0017
Inventor 赵树森林学春李达张志研王奕博梁浩刘燕楠马文浩
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI