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Ultrasonic fingerprint sensor and fingerprint recognition module

A fingerprint sensor and ultrasonic technology, applied in the field of sensors, can solve the problems of high processing cost, difficult processing of long columnar piezoelectric columns, and difficulty in mass production, and achieve low processing cost, low processing difficulty, and strong emission and penetration capabilities Effect

Pending Publication Date: 2018-12-07
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the long columnar piezoelectric columns of ceramics are difficult to process, and the processing cost is high, which brings great difficulties to mass production.

Method used

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  • Ultrasonic fingerprint sensor and fingerprint recognition module
  • Ultrasonic fingerprint sensor and fingerprint recognition module
  • Ultrasonic fingerprint sensor and fingerprint recognition module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0034] Please refer to figure 1 As shown, the present embodiment provides an ultrasonic fingerprint sensor 100, which includes:

[0035] The emitting part 110 includes a lower emitting electrode 111, an emitting piezoelectric layer 112, and an emitting upper electrode 113 stacked from bottom to top, and the emitting piezoelectric layer 112 is a whole-layer structure;

[0036] The isolation layer 120 is superimposed on the emitting part 110;

[0037] The receiving part 130 includes a receiving lower electrode 131 , a receiving piezoelectric layer 132 and a receiving upper electrode 133 stacked on the isolation layer 120 from bottom to top.

[0038] The ultrasonic fingerprint sensor 100 of this embodiment is mainly composed of a hybrid structure consisting of a transmitting part 110, a receiving part 130 and an intermediate isolation layer 120. The receiving part 130 is on the upper part, close to the sensing surface of the ultrasonic fingerprint sensor 100, and the transmittin...

no. 2 example

[0049] Please refer to image 3 , the present embodiment provides an ultrasonic fingerprint sensor 200, the structure of which is substantially the same as that of the ultrasonic fingerprint sensor 100 in the first embodiment, except that the protective layer only includes the upper protective layer 141 covering the upper surface of the receiving part 130, This is because the receiving part 130 is provided with a convex structure of the piezoelectric column 134, which is easy to accumulate dust, so it needs to be protected by the upper protective layer 141, while the emitting part 110 is a flat structure, which does not need to be protected.

no. 3 example

[0051] Please refer to Figure 4 , this embodiment provides a fingerprint identification module 300, which includes the ultrasonic fingerprint sensor 100 of the first embodiment. The fingerprint recognition module 300 includes a glass cover 310 , an ultrasonic fingerprint sensor 100 and a control chip 320 , the glass cover 310 is arranged on the receiving part 130 of the ultrasonic fingerprint sensor 100 , and the control chip 320 is located under the transmitting part 110 of the ultrasonic fingerprint sensor 100 .

[0052] The working principle of the fingerprint recognition module 300 is as follows:

[0053] When a finger touches or approaches the glass cover 310, a voltage with a resonant frequency within the ultrasonic frequency band is applied to the transmitting part 110 and the receiving part 130 from the outside, and the transmitting piezoelectric layer 112 and the receiving piezoelectric layer 132 will produce high-frequency fluctuation deformation , and transmit an ...

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PUM

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Abstract

The invention, which relates to the sensor field, provides an ultrasonic fingerprint sensor and a fingerprint recognition module. The ultrasonic fingerprint sensor comprises a transmitting part, an isolation layer, and a receiving part. The transmitting part includes a lower transmitting electrode, a transmitting piezoelectric layer, and an upper transmitting electrode that are laminated from bottom to top; and the transmitting piezoelectric layer has an overall layer structure. The isolation layer is laminated on the transmitting part. The receiving part includes a lower receiving electrode,a receiving piezoelectric layer and an upper receiving electrode which are arranged and stacked on the isolation layer from bottom to top. According to the ultrasonic fingerprint sensor, the processing difficulty is reduced and the processing cost is lowered, so that the batched production of the ultrasonic fingerprint sensors is realized; and the ultrasonic emission and penetrating abilities areenhanced. Besides, the fingerprint recognition module includes the ultrasonic fingerprint sensor; and the fingerprint recognition module is capable of generating a clear fingerprint image.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an ultrasonic fingerprint sensor and a fingerprint identification module. Background technique [0002] The ultrasonic fingerprint sensor recognizes fingerprints by emitting and detecting the reflected ultrasonic waves. The existing ultrasonic fingerprint sensor generally consists of a piezoelectric layer, a transmitting electrode, a receiving electrode, etc., wherein the piezoelectric layer includes piezoelectric columns arranged in a row, and the receiving electrode includes a plurality of receiving electrodes formed on one end surface of the piezoelectric layer. The emitter electrode includes a plurality of emitter electrodes formed on the other end surface of the piezoelectric layer. The piezoelectric layer has a piezoelectric effect and can be used to transmit or receive ultrasonic waves. Each receiving electrode is connected to a column of piezoelectric columns, and each emitter is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306G06V40/1365
Inventor 刘斌熊伟余维嘉范为汤威向宇罗健飞
Owner SAE TECH DELEVOPMENT DONGGUAN