A computer motherboard device
A technology for computer motherboards and motherboards, which is applied in computing, instruments, and digital processing power distribution, etc. It can solve the problems of large space occupied by cooling modules and limit the development of miniaturized equipment, so as to optimize the integration and installability and solve the problem of occupying too much space Effect
Active Publication Date: 2022-01-18
SHENZHEN EMDOOR DIGITAL TECH
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Problems solved by technology
[0005] In view of this, the purpose of the present invention is to provide a computer motherboard device, the structural design of the computer motherboard device can effectively solve the problem that the heat dissipation module in the current computer equipment occupies too much space on the motherboard, which limits the miniaturization of the equipment, etc. technical issues
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Embodiment Construction
[0025] The embodiment of the invention discloses a computer motherboard device to solve the technical problem that the cooling module occupies too much space on the motherboard in current computer equipment and limits the miniaturization development of the equipment.
[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see figure 1 , figure 2 and Figure 4 , figure 1 A schematic diagram of a partial exploded structure of a computer motherboard device provided by an embodiment of the present inventio...
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The invention discloses a computer motherboard device, comprising a motherboard, a CPU, a hard disk, a heat-dissipating copper tube assembly, and a pressing block for pressing the heat-dissipating copper tube assembly against the main board, the top surface of the pressing block is provided with a vertical convex The column structure, the convex column structure is used to lift the hard disk away from the lower pressing block to a preset distance for installation and fixation; the position where the hard disk is connected with the convex column structure is also provided with a shock-absorbing and heat-insulating structure. The hard disk is integrated with the heat-dissipating copper tube assembly through the special structure on the pressing block. The pressing block presses the heat-dissipating copper tube assembly and the motherboard closely together. In order to avoid the heat conduction of the heat dissipation copper pipe assembly during operation, the hard disk temperature is too high. The same is true for setting the cushioning and heat insulation structure. The design of the joint can avoid the vibration during heat dissipation and the transmission of high temperature to the hard disk to affect the work of the hard disk. The hard disk and the cooling module are integrated in the same motherboard area, which optimizes the integrated installation between the modules on the motherboard.
Description
technical field [0001] The invention relates to the technical field of computer hardware, and more specifically, relates to a computer motherboard device. Background technique [0002] In the existing internal layout of the computer, the cooling module is generally separated from other components. In the structural layout of the whole machine, the cooling module is stacked together with the hard disk and the motherboard as a component that occupies a large space. This design is to avoid mutual interference, but it has a great limitation on the size and space of the whole machine. The existing heat dissipation modules on the market are generally non-standard customized, with a wide variety. Conventionally, heat dissipation modules are composed of fans, heat pipes, and copper plates, while other hardware, especially hard drives, are separated from heat dissipation modules independently to prevent mutual interference. The components on the entire motherboard take up a lot of s...
Claims
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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/184G06F1/20
Inventor 任广旭张治宇钟景维石庆马保军张铁军刘学友谭小兵王超产
Owner SHENZHEN EMDOOR DIGITAL TECH