Cover plate structure, display device, and method for manufacturing cover plate structure
A cover plate and substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as easy delamination, achieve enhanced bonding effect, avoid delamination, and buffer bending stress Effect
Active Publication Date: 2018-12-18
YUNGU GUAN TECH CO LTD
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Problems solved by technology
[0003] In view of this, the present invention is committed to providing a cover structure, a display device and a method for preparing the cover structure, so as to solve the problem that the existing cover structure is prone to delamination during the bending process
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] Figure 1a Shown is a front structural schematic view of the cover structure provided by the first embodiment of the present invention. Figure 1b Shown is a schematic top view of the first substrate in the cover structure provided by the first embodiment of the present invention.
[0027] Such as Figure 1a As shown, the cover plate structure provided by the embodiment of the present invention includes a first substrate 1, an adhesive lay...
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Abstract
The invention provides a cover plate structure, a display device and a method for manufacturing the cover plate structure. The cover plate structure comprises a first substrate, an adhesive layer anda second substrate which are stacked in sequence, the adhesive layer is used for bonding the first substrate and the second substrate, the first substrate comprises a window region and a non-window region, and the non-window region of the first substrate is provided with a groove. A cover plate structure, by providing a plurality of slots in the non-window region of the first substrate, and defining a manner in which the adhesive material in the adhesive layer spills over onto other layer structures adjacent to the surface of the first substrate remote from the adhesive layer, thereby achieving the purpose of enhancing the adhesive effect between the cover structure and the other layer structures and thereby achieving the purpose of sufficiently avoiding delamination of the cover structure. In addition, in the bending process of the cover plate structure, the groove provided on the first substrate also has the effect of buffering the bending stress, so that the delamination phenomenonof the cover plate structure can be further avoided.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a cover structure, a display device and a method for preparing the cover structure. Background technique [0002] As a component of the display device, the cover structure has the functions of protecting the display device of the display device and decorating the appearance of the display device, and its importance is self-evident. In order to adapt to the bendable characteristics of the flexible display device, the cover structure included in the flexible display device is also required to be bendable. However, in the actual bending process of the existing flexible display device, the cover plate structure is prone to delamination. Contents of the invention [0003] In view of this, the present invention aims to provide a cover structure, a display device and a method for preparing the cover structure, so as to solve the problem that the existing cover structure is prone to ...
Claims
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Login to View More IPC IPC(8): H01L51/52
CPCH10K50/841H10K50/8426
Inventor 林昶
Owner YUNGU GUAN TECH CO LTD