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Microwave millimeter wave three-dimensional near-field data acquisition and imaging system

A technology of data acquisition and imaging system, applied in radio wave measurement system, radio wave reflection/re-radiation, utilization of re-radiation, etc. The effect of improving research efficiency and high scanning accuracy

Pending Publication Date: 2018-12-25
XIAMEN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the problems in the existing near-field scanning technology such as low precision, complex construction, single measurement mode, and only one scan can obtain the field distribution of a single frequency, and provide a solution suitable for open waveguides, integrated circuits, metamaterials, ultra- Microwave and millimeter wave three-dimensional near-field data acquisition and imaging system for surfaces and other devices and circuits

Method used

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Embodiment Construction

[0016] The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0017] An example of the present invention is figure 1 As shown, the tested sample is a planar artificial surface plasmon waveguide. The present invention is mainly composed of seven parts, namely: control computer 1, test probe 2, three-axis motion controller 3, linear translation platform 4, vector network analyzer 5, metal support 6 and sample platform 7;

[0018] The control computer 1 is respectively connected to the three-axis controller 3 and the vector network analyzer 5 through a USB cable and a USB-GPIB adapter cable, and uses VISA of LabVIEW to realize data communication, and the three-axis motion controller 3 is connected to the linear controller through a cable. The translation stage 4 is connected; the vector network analyzer 5 is respectively connected with the test probe 2 and one end of the tested sample 8 through a flexible ...

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Abstract

The invention relates to a microwave millimeter wave three-dimensional near-field data acquisition and imaging system, and belongs to the field of electromagnetic field measurement technology. The system is provided with a control computer, a test probe, a three-axis motion controller, a linear translation stage, a vector network analyzer, a metal bracket, and a sample stage, wherein the control computer is respectively connected to a three-axis motion controller and a vector network analyzer; the three-axis motion controller is connected to the linear translation stage; the sample stage is mounted on the linear translation stage; the metal bracket is arranged above the linear translation stage; the test probe is fixed on the metal bracket and connected to the vector network analyzer alongwith a port of the tested sample. A high-performance long-stroke linear motion platform and a coaxial test probe can be used to scan an electric field or magnetic field one by one at different frequencies in a specified area around the tested sample to obtain relevant amplitude and phase information data, and can analyze, process and display a field distribution data through a computer.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic field measurement, in particular to a microwave and millimeter wave three-dimensional near-field data acquisition and imaging system. Background technique [0002] Electromagnetic metamaterials are composite materials with periodic or quasi-periodic structures artificially designed. Compared with traditional materials, this composite material has specific physical properties, and this specific physical property depends not only on the intrinsic properties of the constituent materials, but also on its subwavelength structural size parameters. Studies have shown that electromagnetic metamaterials have a variety of novel physical properties such as negative refractive index, superabsorption, optical rotation, and electromagnetic induction-like transparency, and these properties can be regulated by structural size design. In recent years, in order to facilitate the integration and application...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S13/89
CPCG01S13/89
Inventor 叶龙芳丰豪柳清伙
Owner XIAMEN UNIV
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