Unlock instant, AI-driven research and patent intelligence for your innovation.

A computer integrated circuit board heat dissipation device based on dust-free cooling technology

A technology of integrated circuit board and cooling technology, which is applied in the computer field, can solve the problems of reduced heat dissipation capacity and burning loss of electrical components, and achieve the effect of ensuring normal production and operation.

Inactive Publication Date: 2019-01-04
郑州辛西亚信息科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] With the continuous development of integrated circuits, its technology has been widely used in the computer field. However, due to the large number of electrical elements usually installed on integrated circuits, a large amount of heat will be generated in a short period of time during operation. In order to ensure smooth operation, usually A cooling device needs to be installed, and traditional computers are usually equipped with an independent cooling device. Although the cooling effect is good, the external air will be directly introduced into the inside of the chassis, so that the floating dust and water vapor in the air will accumulate on the dusty circuit board and cover the electrical surface. The surface of the component causes the heat dissipation capacity of the electrical component to drop significantly, and even burns out.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A computer integrated circuit board heat dissipation device based on dust-free cooling technology
  • A computer integrated circuit board heat dissipation device based on dust-free cooling technology
  • A computer integrated circuit board heat dissipation device based on dust-free cooling technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] see Figure 1~3 , a computer integrated circuit board cooling device based on dust-free cooling technology, including a substrate 1, an integrated circuit board 2 is provided in the center of the top surface of the substrate 1, and a card slot 3 is provided on the edge of the top surface of the substrate 1. The groove 3 is an annular groove, and the card groove 3 is sleeved on the outside of the integrated circuit board 2, and the sealing cover 5 matched with the integrated circuit board 2 is sleeved in the card groove 3, and the opening end of the sealing cover 5 is provided with a The sealing sleeve 4 matched with the card slot 3, the sealing sleeve 4 is made of rubber material, the sealing cover 5 is made of transparent material, and the top of the sealing cover 5 is evenly embedded with a number of cooling fins 6, the The cooling fins 6 are made of aluminum, and the integrated circuit board 2 is sealed by the sealing cover 5, which is effectively isolated from the o...

Embodiment 2

[0026] This embodiment is a further elaboration on the basis of Embodiment 1. The substrate 1 is provided with a heat dissipation copper pipe 7, the heat dissipation copper pipe 7 is a serpentine structure, and the bottom surface of the substrate 1 is evenly provided with a number of support rods. 11. One of the support rods 11 is provided with an air intake cylinder 13, and the other said support rod 11 is provided with an exhaust cylinder 9. The air intake cylinder 13 is an open bottom structure, and the top of the air intake cylinder 13 passes through the inlet Air pipe 12 connects the air intake end of heat dissipation copper pipe 7 through, and the inner cavity top wall of air intake tube 13 is provided with diversion bucket 131 that cooperates with air intake tube 12, and air intake tube 13 is provided with suction fan 132, and the suction fan 132 is arranged in the air intake tube 13. The fan 132 is fixedly connected to the inner cavity wall of the air intake tube 13 thr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a computer integrated circuit board heat dissipation device based on dust-free cooling technology, including a substrate, wherein an integrated circuit board is arranged at thecenter of the top end face of the substrate, the edge of the top end face of the base plate is provided with a clamping groove, the abutment groove is an annular groove, the card slot is sleeved on the outside of the integrated circuit board, the card slot is sleeved with a sealing cover which is matched with the integrated circuit board, the open end of the sealing cover is provided with a sealing sleeve matched with the clamping groove, the top end of the sealing cover is uniformly embedded with a plurality of heat dissipating fins, a heat dissipating copper tube is arranged in the base plate, a plurality of supporting rods are uniformly arranged on the bottom end surface of the base plate, one supporting rod is provided with an air inlet cylinder, and the other supporting rod is provided with an exhaust cylinder. The integrated circuit board of the invention is sealed by the sealing cover, effectively isolated from the outside, can effectively prevent the floating dust and water vapor in the outside air from affecting the operation of the integrated circuit board, and the heat generated by the operation of the integrated circuit board is radiated from the outside through the heat dissipating fins, thereby ensuring the normal production operation of the integrated circuit board.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer integrated circuit board cooling device based on dust-free cooling technology. Background technique [0002] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. [0003] Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers. [0004] An integrated circuit is a tiny ele...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 贾振鹏
Owner 郑州辛西亚信息科技有限公司