A computer integrated circuit board heat dissipation device based on dust-free cooling technology
A technology of integrated circuit board and cooling technology, which is applied in the computer field, can solve the problems of reduced heat dissipation capacity and burning loss of electrical components, and achieve the effect of ensuring normal production and operation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0024] see Figure 1~3 , a computer integrated circuit board cooling device based on dust-free cooling technology, including a substrate 1, an integrated circuit board 2 is provided in the center of the top surface of the substrate 1, and a card slot 3 is provided on the edge of the top surface of the substrate 1. The groove 3 is an annular groove, and the card groove 3 is sleeved on the outside of the integrated circuit board 2, and the sealing cover 5 matched with the integrated circuit board 2 is sleeved in the card groove 3, and the opening end of the sealing cover 5 is provided with a The sealing sleeve 4 matched with the card slot 3, the sealing sleeve 4 is made of rubber material, the sealing cover 5 is made of transparent material, and the top of the sealing cover 5 is evenly embedded with a number of cooling fins 6, the The cooling fins 6 are made of aluminum, and the integrated circuit board 2 is sealed by the sealing cover 5, which is effectively isolated from the o...
Embodiment 2
[0026] This embodiment is a further elaboration on the basis of Embodiment 1. The substrate 1 is provided with a heat dissipation copper pipe 7, the heat dissipation copper pipe 7 is a serpentine structure, and the bottom surface of the substrate 1 is evenly provided with a number of support rods. 11. One of the support rods 11 is provided with an air intake cylinder 13, and the other said support rod 11 is provided with an exhaust cylinder 9. The air intake cylinder 13 is an open bottom structure, and the top of the air intake cylinder 13 passes through the inlet Air pipe 12 connects the air intake end of heat dissipation copper pipe 7 through, and the inner cavity top wall of air intake tube 13 is provided with diversion bucket 131 that cooperates with air intake tube 12, and air intake tube 13 is provided with suction fan 132, and the suction fan 132 is arranged in the air intake tube 13. The fan 132 is fixedly connected to the inner cavity wall of the air intake tube 13 thr...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


