A brazing method for large-scale antenna and large-area grounding of microstrip board

Abstract

The invention discloses a brazing method of large-area ground connection of a large-sized antenna and micro-strip boards. The brazing method comprises the steps that welding pieces and a large-sized antenna to-be-welded face are cleaned; the appropriate amount of welding flux is brushed on the large-sized antenna to-be-welded face; the welding pieces and the micro-strip boards are installed on thelarge-sized antenna to-be-welded face in sequence, and the large-sized antenna to-be-welded face, the welding pieces and the micro-strip boards are combined to form welding combinations; a high-temperature-resistant bag wraps the welding combinations; the air in the high-temperature-resistant bag is exhausted; a drying room conducts heating on the high-temperature-resistant bag; after the temperature of each welding combination is equal to the welding temperature, heating stops; and after a weld joint is cooled to enable the temperature to be equal to the room temperature, the high-temperature-resistant bag is taken down. By the adoption of the brazing method, the interatomic binding force can be formed between the large-sized antenna and the micro-strip boards, and therefore the ground resistance between the large-sized antenna and the micro-strip boards is reduced, the electric property, the heat conduction and other performance of the large-sized antenna and the micro-strip boardsare improved, and the requirement of high-strength connection for environmental applicability and the requirement of microwave signal transmission for low-loss connection can be met.

Description

technical field [0001] The invention relates to the technical field of brazing, in particular to a brazing method for large-area grounding of a large-scale antenna and a microstrip plate. Background technique [0002] The integration of platform load and structure and function is the development trend of radar electronic equipment integration. Microwave modules or microwave functional units in electronic equipment have increasingly high requirements for weight reduction design, electrical signal transmission performance, and long-term environmental reliability. The typical design feature of the core circuit using microwave composite dielectric substrates is that on large-scale aluminum alloy components The microwave module or microwave functional unit of the radar system is formed by connecting the microstrip circuit in a large area. This has a large number of applications in the existing radar electronic equipment, such as large-scale microstrip correction network and so o...

AI Technical Summary

Problems solved by technology

The mechanical installation connects the large-size antenna and the microstrip board through screws, but the large-size antenna and the microstrip board are not absolutely flat. After the screw connection, there is a large amount of air gap between the microstrip board and the large-size antenna, which affects the large-size Grounding area and heat conduction effect of antenna and microstrip plate

The air gap between the microstrip board and the large-size antenna can be filled by bonding with conductive adhesive. However, the conductive adhesive contains a large amount of polymer materials, which will increase the grounding resistance of the microstrip board and weaken the electrical resistance of the microstrip board. performance, and the conductive adhesive has a certain shelf life, which does not meet the long-term reliability requirements of the product

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