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A manufacturing method of a non-metallized step groove and a PCB

A technology of non-metallization and production methods, which is applied in the fields of printed circuits connected with non-printed electrical components, multi-layer circuit manufacturing, printed circuit manufacturing, etc. It can solve the problems that the manufacturing process cannot meet the requirements, poor versatility, and difficult operation. , to achieve the effect of reducing operation difficulty, simple process method and improving dimensional accuracy

Inactive Publication Date: 2019-01-15
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a method for manufacturing a non-metallized stepped groove and a PCB for the deficiencies of the prior art, so as to solve the manufacturing process existing in the prior art when making a non-metallized stepped groove of a small size Defects that cannot meet requirements, difficult operation and poor versatility

Method used

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  • A manufacturing method of a non-metallized step groove and a PCB
  • A manufacturing method of a non-metallized step groove and a PCB
  • A manufacturing method of a non-metallized step groove and a PCB

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Embodiment 1

[0037] see figure 1 , the first embodiment provides a method for manufacturing a non-metallized stepped groove, comprising the steps of:

[0038] S101. Mix and press the top layer core board, prepreg and bottom core board according to the predetermined stacking sequence to make a multi-layer board, such as figure 2 shown.

[0039] Wherein, the top core board is a common material core board, and the bottom layer core board is a high frequency material core board.

[0040] It should be noted that micro-sized stepped grooves are mainly used in high-frequency microwave RF boards. High-frequency materials have extremely low dielectric loss (excellent electrical properties), but they are expensive. Therefore, general-purpose high-frequency microwave RF boards They are all made by mixing high-frequency materials and ordinary materials. In order to ensure that the signal transmission of the radio frequency terminal is not affected by ordinary materials, a stepped groove with comple...

Embodiment 2

[0055] The second embodiment provides a PCB, which includes a non-metallized stepped groove, and the stepped groove is manufactured according to the manufacturing method provided in the first embodiment.

[0056] There is no copper layer on the side wall and the bottom of the non-metallized stepped groove.

[0057] Compared with the prior art, the PCB provided by the embodiment of the present invention has a simpler process method when making a micro-sized non-metallized stepped groove, and does not require special equipment or a special process, which not only reduces the difficulty of operation, but also improves the efficiency of the stepped groove. Dimensional accuracy, suitable for mass production.

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Abstract

The embodiment of the invention discloses a manufacturing method of a non-metallized step groove and a PCB. The method comprises the following steps: a multi-layer board is manufactured by mixing a top-layer core board, a prepreg and a bottom-layer core board; The multilayer plate is milled from the top layer core plate to the inside of the prepreg sheet until only a certain thickness of medium layer is left in the prepreg sheet, so as to obtain a multilayer plate with a step groove; the multilayer plate is milled from the top layer core plate to the inside of the prepreg sheet to obtain a step groove. Laser ablating the dielectric layer to remove the remaining dielectric layer; The residual medium on the copper surface is further removed by the sandblasting process, so that the copper surface of the bottom core plate at the bottom of the step groove is completely exposed; Removing the oxide layer on the copper surface through a micro-etching process; The copper layer of the bottom core plate at the bottom of the step groove is etched off to form a non-metallized step groove. Compared with the prior art, the technical proposal provided by the invention has the advantages of simplerprocess, no special equipment or special process, which not only reduces the operation difficulty, but also improves the dimension precision of the step groove, and is suitable for mass production.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of printed circuit boards, in particular to a method for manufacturing a non-metallized stepped groove and a PCB. Background technique [0002] With the advancement of science and technology, electronic products have become indispensable daily necessities in people's lives, and PCB (Printed Circuit Board, printed circuit board) is an important part of electronic products. In recent years, people have more and more functional requirements for electronic products. The more it is, the higher the requirements are for the PCB. Usually, in order to facilitate the installation of devices with special functions or devices that need to be sunken on the PCB, it is often necessary to set stepped grooves on the PCB. The stepped grooves are also an important part of realizing high-power heat dissipation of products, and are widely used in the industry. [0003] The side walls of the stepped grooves...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46H05K1/18
CPCH05K1/183H05K3/0032H05K3/0044H05K3/0055H05K3/4697
Inventor 焦其正纪成光王洪府王小平
Owner DONGGUAN SHENGYI ELECTRONICS