Preparation method for macromolecular nanometer bowl structure
A polymer and nanobowl technology, applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of low fidelity of transfer graphics, microstructure fracture, time-consuming processing, etc., to achieve The effect of short preparation cycle, complete microstructure and low cost
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Embodiment 1
[0018] A method for preparing a polymer nanobowl structure, comprising the steps of:
[0019] (1) Preparation of the mixed solution: mix polymethyl methacrylate powder with a molar mass of 50 kg / mol and a degree of dispersion of 1.1 with polystyrene powder with a molar mass of 48 kg / mol and a degree of dispersion of 1.02 by 1: Mix at a mass ratio of 9; add 1 mg of mixed powder per 1 ml of toluene to obtain a 1 mg / ml mixed polymer toluene solution;
[0020] (2) Treatment of silicon wafers: cut the circular single crystal silicon wafers into square silicon wafers with a size of 1×1 cm, and place the cut silicon wafers in a 80% H 2 SO 4 , 30%H 2 o 2 and deionized water according to the volume ratio of 100:35:15 in the cleaning solution made of 70 ° C for 32 minutes, then rinse with deionized water, put it into a plastic beaker, use 20% hydrofluoric acid and deionized The hydrofluoric acid solution prepared by water at a ratio of 1:1 removes the oxide layer on the silicon waf...
Embodiment 2
[0026] A method for preparing a polymer nanobowl structure, comprising the steps of:
[0027] (1) Preparation of the mixed solution: mix polymethyl methacrylate powder with a molar mass of 50 kg / mol and a degree of dispersion of 1.1 with polystyrene powder with a molar mass of 48 kg / mol and a degree of dispersion of 1.02 by 2: Mix at a mass ratio of 8; add 3 mg of mixed powder per 1 ml of toluene to obtain a 3 mg / ml mixed polymer toluene solution;
[0028] (2) Treatment of silicon wafers: cut the circular single crystal silicon wafers into square silicon wafers with a size of 1×1 cm, and place the cut silicon wafers in a 80% H 2 SO 4 , 30%H 2 o 2 and deionized water at a volume ratio of 100:35:15, boiled at 80˚C for 30 minutes, then rinsed with deionized water, put them in a plastic beaker, and washed with 20% hydrofluoric acid and deionized The hydrofluoric acid solution prepared by water at a ratio of 1:1 removes the oxide layer on the silicon wafer, rinses it with deio...
Embodiment 3
[0034] A method for preparing a polymer nanobowl structure, comprising the steps of:
[0035] (1) Preparation of mixed solution: mix polymethyl methacrylate powder with a molar mass of 50 kg / mol and a degree of dispersion of 1.1 with polystyrene powder with a molar mass of 48 kg / mol and a degree of dispersion of 1.02 by 3: Mix at a mass ratio of 7; add 5 mg of mixed powder per 1 ml of toluene to obtain a 5 mg / ml mixed polymer toluene solution;
[0036] (2) Treatment of silicon wafers: cut the circular single crystal silicon wafers into square silicon wafers with a size of 1×1 cm, and place the cut silicon wafers in a 80% H 2 SO 4 , 30%H 2 o 2 and deionized water according to the volume ratio of 100:35:15 in the cleaning solution made of 90 ° C for 28 minutes, then rinse with deionized water, put it into a plastic beaker, and use 20% hydrofluoric acid and deionized The hydrofluoric acid solution prepared by water at a ratio of 1:1 removes the oxide layer on the silicon waf...
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