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Positive thick film photoresist for CIS industry

A technology of photoresist and thick film, which is applied in the direction of optics, optomechanical equipment, photoplate making process of pattern surface, etc. It can solve the problems of glue type collapse, inability to maintain a steep angle, peeling of positive photoresist, etc. , to achieve a high level of effect

Active Publication Date: 2019-01-25
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty of current photoresists is that under the immersion of copper electroplating solution, the high-thickness positive photoresist either peels off or collapses, and cannot maintain a steep angle.

Method used

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  • Positive thick film photoresist for CIS industry
  • Positive thick film photoresist for CIS industry
  • Positive thick film photoresist for CIS industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0017] Mix the raw materials according to the ratio shown in Table 1, wherein the modified phenolic resin is a phenolic resin with the following structure with a molecular weight between 8000 and 15000, which will affect the coating and exposure performance.

[0018]

[0019] The photosensitizer is 2.3.4-trihydroxybenzophenone-1,2-naphthoquinonediazo-5-sulfonate, which affects the deviation of exposure energy.

[0020] The leveling agent is a perfluoroalkyl polyether surfactant, which affects the uniformity of coating.

[0021] The loosening agent is 2,3,4-trihydroxybenzophenone, which affects the gas permeability of the photoresist.

[0022] The solvent is ethyl lactate, which affects the deviation of the viscosity and affects the coating film thickness and exposure energy.

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PUM

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Abstract

The invention belongs to the technical field of semiconductor processing, and relates to a positive thick film photoresist used in CIS industry. 35 wt% of modify phenolic resin, 3-5wt% photosensitizer, 100-500ppm of leveling agenst, 1-3 wt% of porou agent and that balance of ethyl lactate. The thickness of the positive thick film photoresist coat exceeds 50 um, the coat uniformity can be controlled below 5%, and the sectional angle can reach 87 to 90 DEG, so that the resolution can be maintained at a high level.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a positive thick-film photoresist used in the CIS industry. Background technique [0002] Positive photoresist is a patterned transfer tool. Photoresist is a composition composed of resin, photosensitive compound, additive, and solvent. After it is exposed to ultraviolet light, the exposed area and the non-exposed area are in alkaline solvent There is an obvious difference in the liquid, and the developer dissolves the soluble part to obtain the desired pattern. [0003] In the semiconductor manufacturing process, electronic packaging in a narrow sense refers to the process in the post-engineering (ie "back-end") of the semiconductor manufacturing process, and packaging in a broad sense also includes post-engineering and subsequent electronic assembly. In today's advanced packaging, it is difficult to distinguish the boundaries of front-end, back-end and assembl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039
CPCG03F7/039
Inventor 向文胜张兵赵建龙朱坤陆兰
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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