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Method of manufacturing electrostatic chuck plate

A manufacturing method, electrostatic chuck technology, applied in manufacturing tools, holding devices using electrostatic attraction, semiconductor/solid-state device manufacturing, etc., can solve the problems of easy increase in cost, inability to protect parts from peeling off, etc., and achieve the effect of low cost

Pending Publication Date: 2019-01-29
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for example, sometimes the protective member cannot be easily peeled off from the processed workpiece.
In addition, in the case of using a disposable adhesive tape that cannot be reused, the cost required for processing the workpiece is also likely to increase.

Method used

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  • Method of manufacturing electrostatic chuck plate
  • Method of manufacturing electrostatic chuck plate
  • Method of manufacturing electrostatic chuck plate

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Experimental program
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Effect test

Embodiment Construction

[0024] An embodiment of one aspect of the present invention will be described with reference to the drawings. The manufacturing method of the electrostatic chuck plate of this embodiment includes the step of forming a conductor film (refer to figure 1 (A)) and electrode formation steps (refer to figure 1 of (B), figure 1 (C) and figure 2 ).

[0025] In the conductor film forming step, a conductor film containing a metal oxide is provided on the first surface side of the base substrate in which at least the first surface is formed of an insulator. In the electrode forming step, the conductor film is ablated with a laser beam having a wavelength that is transparent to the base substrate, and positive and negative electrodes are formed on the first surface side of the base substrate. The method of manufacturing the electrostatic chuck plate of this embodiment will be described in detail below.

[0026] In the method of manufacturing an electrostatic chuck plate according to...

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PUM

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Abstract

The invention provides a method of manufacturing an electrostatic chuck plate, wherein an electrode can be formed in a cost lower than previous cost. According to the method of manufacturing the electrostatic chuck plate, an electrostatic force is used for attracting and holding a machined object. The method comprises the following steps of a conductive film forming step, namely arranging a conductive film comprising metal oxide on an insulating surface side which is formed by an insulator on a basic substrate; and an electrode forming step, wherein after the conductive film forming step, etching processing is performed on the conductive film by means of a laser beam which is penetrable relative to the base substrate, wherein a positive electrode and a negative electrode are formed on theinsulating surface side of the base substrate.

Description

technical field [0001] The present invention relates to a method of manufacturing an electrostatic chuck plate used when holding a plate-shaped workpiece or the like. Background technique [0002] When processing semiconductor wafers, optical device wafers, packaging substrates, and the like with cutting equipment, grinding equipment, and laser processing equipment, protective members such as adhesive tapes and hard substrates are usually attached to these plate-shaped workpieces. Thereby, the workpiece can be protected from impacts applied during processing or conveyance. [0003] The above-mentioned protective member is usually attached to a workpiece with an adhesive having a certain degree of adhesive force. Therefore, for example, the protective member may not be easily peeled off from the processed workpiece. In addition, in the case of using a non-reusable disposable adhesive tape or the like, the cost required for processing the workpiece tends to increase. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6831H01L21/6833H02N13/00B23Q3/15H01L21/02
Inventor 古田健次里百合子
Owner DISCO CORP