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Plasma-assisted aerosol deposition film-forming method and aerosol deposition device

An aerosol deposition and plasma technology, which is applied in the direction of pressure inorganic powder coating, etc., can solve the problem of increasing the surface roughness of the deposited film and the substrate, and achieve the effects of reducing internal defects, simple process, and reducing the level of leakage current

Active Publication Date: 2021-04-09
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a plasma-assisted aerosol in order to solve the limitation of the anchoring layer in the prior art due to the impact of high-sonic primary particles on the substrate and increase the roughness of the contact surface between the deposited film and the substrate. Deposition and film formation method and aerosol deposition device

Method used

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  • Plasma-assisted aerosol deposition film-forming method and aerosol deposition device
  • Plasma-assisted aerosol deposition film-forming method and aerosol deposition device
  • Plasma-assisted aerosol deposition film-forming method and aerosol deposition device

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specific Embodiment approach 1

[0021] Specific Embodiment 1: In this embodiment, the plasma-assisted aerosol deposition film forming method is implemented according to the following steps:

[0022] The raw gas is input through the exhaust pipe head 5 and stored in the aerosol generating chamber 4, the raw gas is fully mixed with the original particles in the aerosol generating chamber 4 to form an aerosol, and the aerosol passes through the connecting pipeline 7 through the molecular sieve filter 8 Transported in the corona discharger 9, the aerosol particles in the corona discharger 9 are combined with the plasma to be positively charged, the deposition chamber 10 is provided with a negatively charged substrate 12, and the corona discharger 9 is positively charged The aerosol passes through the nozzle 11 and collides with the surface of the substrate 12 at a subsonic speed to achieve deposition, thereby completing the preparation of the aerosol deposition film.

[0023] The purpose of this embodiment is to...

specific Embodiment approach 2

[0025] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the average particle diameter of the primary particles is 100nm-10um.

[0026] The preferred particle size of the primary particles in this embodiment is 100-300 nm, and a film with good film quality can be deposited quickly through the particles with the preferred size.

specific Embodiment approach 3

[0027] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the primary particles are one or more mixed materials among metal materials, ceramic materials and polymeric organic materials.

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Abstract

Plasma-assisted aerosol deposition film-forming method and aerosol deposition device, the present invention aims to solve the limitations of the anchoring layer produced by the collision of high-sonic original particles with the substrate in the prior art, and increase the roughness of the contact surface between the deposited film and the substrate question. Film forming method: The raw material gas is fully mixed with the original particles in the aerosol generating chamber to form an aerosol, and the aerosol is transported to the corona discharger through the connecting pipeline through the molecular sieve filter, and the aerosol particles in the corona discharger are combined with the plasma While positively charged, a negatively charged substrate is set in the deposition chamber, and the aerosol collides with the surface of the substrate at a subsonic speed through the nozzle to achieve deposition. In the aerosol deposition device of the present invention, one end of the connecting pipeline is connected with the aerosol generating chamber, and the other end of the connecting pipeline is connected with the nozzle, and the nozzle is located in the deposition chamber, and a molecular sieve filter and a corona discharger are sequentially arranged on the connecting pipeline. electrical appliances. The invention effectively improves the roughness of the deposited film interface and surface.

Description

technical field [0001] The invention relates to a film-forming method and corresponding preparation device for preparing metal electrodes, ceramic functional layers, polymer particles and composite materials thereof by using a plasma-assisted aerosol deposition process at room temperature, and submicron particles used in the method realization. Background technique [0002] Use micro-nano-sized particles (including but not limited to metal particles, ceramic particles, polymer particles and their composite materials, etc.) The film-making method of the film is widely known and studied by virtue of its low-temperature preparation conditions and fast deposition rate. Usually, primary particles are mixed with a carrier gas (such as nitrogen, helium, or oxygen, etc.), and an aerosol can be formed in a closed space by means of an auxiliary vibration system. The generated aerosol is conveyed by the carrier gas, and shoots to the substrate in the deposition chamber at a supersoni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/04
CPCC23C24/04
Inventor 王琮强天梁峻阁姚钊刘成才白冰
Owner HARBIN INST OF TECH