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A back suction device suitable for wafers and its realization method

A wafer and backside technology, which is applied in the field of backside suction devices, can solve the problems of disturbing wafer particles and air disturbance, and achieve the effect of improving quality and precision

Active Publication Date: 2022-05-06
申集半导体科技(徐州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method will disturb the air around the wafer, and also disturb the particles near the wafer.

Method used

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  • A back suction device suitable for wafers and its realization method
  • A back suction device suitable for wafers and its realization method

Examples

Experimental program
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Effect test

Embodiment

[0033] Such as figure 1 As shown, a back suction device suitable for wafers includes a mechanical arm mechanism 1, a suction cup device 2 is rigidly connected to the mechanical arm mechanism 1, and a vacuum suction device 2 is connected to the suction cup device 2 through a vacuum hose 3. The device 4 is connected, and also includes a positioning platform, and the positioning platform is arranged in cooperation with the suction cup device through the mechanical arm mechanism; the mechanical arm mechanism 1 includes a mechanical arm, and one end of the mechanical arm is rigidly connected with the suction cup device 2, so that The other end of the mechanical arm is provided with a rotating device, and the mechanical arm is tilted with the rotation of the rotating device. The inclination angle of the rotating device is divided into two ends, one section is between 0 degrees and 45 degrees, and the second section is between 45 degrees and 45 degrees. 80 degrees. The suction cup d...

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Abstract

The present invention relates to a wafer sucking device on the back side and its implementation method, comprising a mechanical arm mechanism, a suction cup device is rigidly connected to the mechanical arm mechanism, and a vacuum hose and a vacuum suction device are connected to the suction cup device In connection with each other, a positioning platform is also included, and the positioning platform is arranged in cooperation with the suction cup device through a mechanical arm mechanism. The invention reduces contact with the front of the product, thereby improving product quality.

Description

technical field [0001] The invention relates to a back-side suction device suitable for wafers, in particular to a back-side suction device suitable for wafers and a realization method thereof. Background technique [0002] The current wafer placement method is mainly to fix the wafer horizontally and place the wafer through vertical lifting. In view of the fact that the front of the wafer cannot be directly contacted, it is further divided into a back contact suction sheet and a front non-contact suction sheet. Generally, the back-contact suction sheet needs to cooperate with an additional mechanism to complete the transfer of the wafer. Sometimes the wafer needs to be placed in the groove of the carrier, and there is no additional mechanism on the carrier, so the back suction piece cannot be used directly. Another front-side non-contact chip suction device generally uses the Bernoulli method to suspend the wafer through gas convection to complete the wafer transfer. How...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 陈凯辉任立
Owner 申集半导体科技(徐州)有限公司