Integrated circuit copper-clad plate surface polishing device

Abstract

The invention discloses an integrated circuit copper-clad plate surface polishing device. The polishing device comprises a base, two brackets, two conveying devices and a support plate; the two brackets are fixedly connected to the upper end of the base, the two conveying devices are fixedly connected to the brackets, and the support plate is fixedly connected to the middle of the upper end of thebase. Through the conveying devices, copper-clad plates are not required to be manually placed on a polishing device body one by one during polishing so that manual work can be reduced, the labor cost is reduced, and the work efficiency is improved; through the cooperation between a reciprocating screw and a polishing sleeve, the surfaces of the copper-clad plates can be completely polished to avoid polishing of dead corners, so that the polishing effect is improved; the copper-clad plates are firmly sucked by suckers to achieve a fixing effect; meanwhile, by cooperating with a clamping device, the copper-clad plates are fixed before polishing to avoiding the situation that the polishing effect is affected by slippage during polishing.

Description

technical field [0001] The invention relates to the field of new generation information technology, in particular to a surface grinding device for an integrated circuit copper clad laminate. Background technique [0002] In the production process of existing integrated circuit boards, double-sided circuit boards are the most widely used. The board material used in the production of double-sided circuit boards is generally copper-clad laminates, and it is often necessary to polish off the oxide substances on the surface of copper-clad laminates before transferring. , while the existing copper-clad laminates are polished by manual grinding, the grinding effect is poor, and then artificially use a flat file or gauze to polish the surrounding smoothness and remove burrs. The manual grinding method has the following defects when this double-sided circuit board is made: artificial The grinding force is uneven, the grinding flatness is poor, the grinding speed is slow, and the grin...

AI Technical Summary

Problems solved by technology

[0002] In the production process of existing integrated circuit boards, double-sided circuit boards are the most widely used. The board material used in the production of double-sided circuit boards is generally copper-clad laminates, and it is often necessary to polish off the oxide substances on the surface of copper-clad laminates before transferring. , while the existing copper-clad laminates are polished by manual grinding, the grinding effect is poor, and then artificially use a flat file or gauze to polish the surrounding smoothness and remove burrs. The manual grinding method has the following defects when this double-sided circuit board is made: artificial The grinding force is uneven, the grinding flatness is poor, the grinding speed is slow, and the grinding effect is poor

[0003] The Chinese document is CN207118085U, a double-sided circuit board surface grinding device. The utility model can solve the problems of uneven manual grinding force, poor grinding flatness, slow grinding speed and poor grinding effect in the manual grinding method during double-sided circuit board production. Difficult problem, it can realize the function of fully automatic conversion and grinding of double-sided circuit boards, without manual operation, and has the advantages of uniform grinding force, good grinding flatness, fast grinding speed and good grinding effect, but this device still needs manual placement, and the processing efficiency Low, and there are grinding dead angles in grinding at the same time, and the grinding effect is poor. Therefore, a surface grinding device for integrated circuit copper clad laminates is proposed.

Images