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Semiconductor package device and method of manufacturing the same

一种封装装置、半导体的技术，应用在半导体/固态器件制造、半导体器件、半导体/固态器件零部件等方向，能够解决易于开裂、错误焊接等问题

Active Publication Date: 2019-02-26
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Relatively thicker sections of IMC may be prone to cracking
In addition, due to the gap formed between the side surface of the pad and the dielectric layer of the substrate and / or contamination in the gap, mis-soldering may occur

Method used

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  • Semiconductor package device and method of manufacturing the same
  • Semiconductor package device and method of manufacturing the same
  • Semiconductor package device and method of manufacturing the same

Examples

Experimental program
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Embodiment Construction

[0026] Figure 1A A cross-sectional view of a semiconductor package device 1 according to some embodiments of the present disclosure is illustrated. The semiconductor package 1 comprises a passivation layer 10 , a dielectric layer 11 , an electronic component 12 , a package body 13 , an interconnect structure 14 (also referred to as a conductive element) and an electrical contact 15 .

[0027] The passivation layer 10 has a top surface 101 (also referred to as a first surface) and a bottom surface 102 (also referred to as a second surface) opposite the top surface. In some embodiments, passivation layer 10 comprises silicon oxide, silicon nitride, gallium oxide, aluminum oxide, scandium oxide, zirconium oxide, lanthanum oxide, hafnium oxide, another oxide, another nitride, or both. combination of one or more than two. In some embodiments, passivation layer 10 may be replaced with a solder resist liquid (eg, in the form of ink) or a film, depending on the specifications of var...

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PUM

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Abstract

A semiconductor package device comprises a passivation layer, a conductive element, a redistribution layer (RDL) and an electronic component. The passivation layer has a first surface and second surface opposite to the first surface. The conductive element is within the passivation layer. The conductive element defines a recess facing the second surface of the passivation layer. The RDL is on thepassivation layer and electrically connected with the conductive element. The electronic component is disposed on the RDL and electrically connected with the RDL.

Description

technical field [0001] The present disclosure generally relates to a semiconductor package device and a method of manufacturing the same. More particularly, the present disclosure relates to semiconductor package devices including bonding pad structures and methods of manufacturing the same. Background technique [0002] A semiconductor package device may include solder balls that electrically connect electronic components to a substrate. In comparable semiconductor package devices, solder balls may be bonded directly to planar pads. Those pads are referred to as "Solder Mask Defined (SMD)" type pads. However, the connection between the solder ball and the solder pad typically cannot withstand relatively large lateral stresses, as this may lead to delamination of the solder ball. [0003] When trying to solve the above-mentioned problems, the side surfaces of the pads may be exposed from the substrate and the solder balls are connected to both the side surfaces and the bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/538
CPCH01L23/49816H01L23/49838H01L23/5386H01L2224/73204H01L2924/18161H01L2224/13147H01L2224/81193H01L2224/81801H01L23/3128H01L21/6835H01L2221/68345H01L24/16H01L2924/15311H01L2924/181H01L24/13H01L2224/81192H01L2224/16225H01L23/49827H01L24/11H01L2224/11001H01L2224/81001H01L24/81H01L2224/1147H01L2224/1146H01L2224/11462H01L24/29H01L24/32H01L2224/32225H01L2224/92125H01L2224/83001H01L24/83H01L24/92H01L2224/13155H01L2224/814H01L2224/13144H01L2224/2919H01L2224/81447H01L2224/29191H01L2224/81455H01L2224/81444H01L2224/131H01L2924/00012H01L2924/00014H01L2924/0665H01L2924/013H01L2924/014H01L2924/066H01L2924/07025H01L2924/0715H05K1/111H01L24/03H01L23/3171H01L24/05H01L2224/02351H01L2224/0391H01L2224/05548H01L2224/05567H01L2224/13024
Inventor 吕文隆
Owner ADVANCED SEMICON ENG INC