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A kind of preparation method of graphene/polyimide composite material

A technology of composite materials and polyimide, which is applied in the field of preparation of graphene/polyimide composite materials, can solve the problems of decreased electrical conductivity and thermal conductivity, non-compliance with green chemistry, use of dangerous drugs, etc., and achieve excellent electrical conductivity The effect of high stability, simple operation and good compatibility

Active Publication Date: 2021-05-18
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The modification of graphene in this way makes the surface of graphene have a large number of oxygen-containing functional groups, which makes the dispersion of graphene excellent, but the introduction of surface functional groups will destroy the delocalized large π bond structure of graphene, resulting in electrical conductivity. And the thermal conductivity is reduced, and the process is cumbersome and a large amount of dangerous drugs are used, which does not meet the requirements of green chemistry

Method used

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  • A kind of preparation method of graphene/polyimide composite material
  • A kind of preparation method of graphene/polyimide composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of preparation method of graphene / polyimide composite material, comprises the steps:

[0032] (1) Add 0.1000g graphene to 20mL N-N'-dimethylacetamide, under the action of ultrasonic waves, the graphene is fully dispersed to obtain a graphene / amide solvent system;

[0033] (2) Weigh 0.4000g 4,4'-diaminodiphenyl ether and 1.0712g bisphenol A type diether dianhydride, dissolve 4,4'-diaminodiphenyl ether in 10mLN-N'-dimethyl In acetamide, the reaction temperature is 20-40°C, add bisphenol A diether dianhydride in batches, after all the bisphenol A diether dianhydride is added, continue stirring for 1.5-3h to prepare a polyamic acid solution;

[0034] (3) Under the action of mechanical stirring, take 5.76 mL of the graphene / amide solvent system obtained in step (1) and slowly add it to the polyamic acid solution obtained in step (2), and continue mechanical stirring to make the graphene in the polyamic acid solution Fully dispersed in the amic acid solution to obtain...

Embodiment 2

[0038] A kind of preparation method of graphene / polyimide composite material, comprises the steps:

[0039] (1) Graphene surface modification: 0.1000g graphene was added to 20mL N-N'-dimethylacetamide containing 0.05mL hyperbranched dispersant SilokDispers 7455, and the graphene was fully dispersed under the action of ultrasonic waves. Obtain graphene / hyperbranched dispersant / amide solvent system;

[0040] (2) Weigh 0.4000g 4,4'-diaminodiphenyl ether and 1.0712g bisphenol A type diether dianhydride, dissolve 4,4'-diaminodiphenyl ether in 10mL N-N'-dimethyl In acetamide, the reaction temperature is 20-40°C, add bisphenol A type diether dianhydride in batches, after all the bisphenol A type diether dianhydride is added, continue to stir for 1.5-3h, and obtain a polyamic acid solution ;

[0041] (3) Under the action of mechanical stirring, slowly add 5.76 mL of the graphene / hyperbranched dispersant / amide solvent system obtained in step (1) into the polyamic acid solution obtain...

Embodiment 3

[0045] A kind of preparation method of graphene / polyimide composite material, comprises the steps:

[0046] (1) Graphene surface modification: 0.1000g graphene was added to 20mL N-N'-dimethylacetamide containing 0.05mL hyperbranched dispersant SilokDispers 7455, and the graphene was fully dispersed under the action of ultrasonic waves. Obtain graphene / hyperbranched dispersant / amide solvent system;

[0047] (2) Weigh 0.8200g of 2,2'-bis(4-aminophenoxyphenyl)propane and 0.6386g of diphenyl ether tetracarboxylic dianhydride, and mix 2,2'-bis(4-aminophenoxyphenyl) Base) Propane is dissolved in 10mL N-N'-dimethylacetamide, the reaction temperature is 20-40°C, add diphenyl ether tetracarboxylic dianhydride in batches, and continue stirring after all diphenyl ether tetracarboxylic dianhydride is added 1.5-3h to prepare polyamic acid solution;

[0048] (3) Under the action of mechanical stirring, slowly add 5.76 mL of the graphene / hyperbranched dispersant / amide solvent system obtained...

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Abstract

The invention discloses a preparation method of a graphene / polyimide composite material. Graphene is added to an amide solvent containing a hyperbranched dispersant, and under the action of ultrasonic waves, the graphene / hyperbranched dispersant / amide is obtained. Solvent-like system; the polyamic acid solution is obtained by condensation polymerization of diamine and dibasic anhydride monomers in amide solvents; slowly add the obtained graphene / hyperbranched dispersant / amide solvent system under the action of mechanical stirring In the polyamic acid solution, graphene is fully dispersed in the polyamic acid solution by continuous machinery to obtain a polyamic acid / graphene / amide solvent composite system. The obtained composite system is filmed, and the solvent is volatilized to obtain a polyamic acid / graphene composite, and then the temperature is raised for imidization to obtain a graphene / polyimide composite material. The graphene / polyimide composite material prepared by the invention does not destroy the structure of the graphene, and the graphene can be uniformly dispersed in the polyimide and has good compatibility with the matrix.

Description

technical field [0001] The invention relates to the technical field of polymer-based composite materials, in particular to a preparation method of graphene / polyimide composite materials. Background technique [0002] Polyimide is a heterocyclic polymer insulating material with a characteristic structure of amide rings. As a special engineering material, polyimide has no obvious melting point, small thermal expansion coefficient, excellent electrical properties, mechanical properties, heat resistance and radiation resistance in the temperature range of 200-400 ° C, and good comprehensive performance. It is widely used in aerospace , electronics, liquid crystal and other fields. Combining polyimide and graphene to make a composite material can improve electrical and thermal conductivity and expand the application range of polyimide. [0003] Graphene has a large specific surface area and excellent electronic conductivity, and has good light transmission and thermal conductiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K9/04C08K3/04C08J5/18
CPCC08J5/18C08J2379/08C08K9/04C08K3/042
Inventor 戴培邦周彪吴冬梅莫传群
Owner GUILIN UNIV OF ELECTRONIC TECH