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Fluorine compound modified EVA (Ethylene Vinyl Acetate Copolymer) packaging glue film

A technology for encapsulating adhesive films and fluorine compounds, which can be applied to films/sheets without carriers, adhesives, adhesive additives, etc., which can solve the problems of increasing costs and continuing risks, achieve good water vapor barrier properties, improve tensile properties, and resist Effects of PID Phenomenon

Inactive Publication Date: 2019-03-01
CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Replacing EVA is also one of the options, but the new material brings cost increase and continuous risk in use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A fluorine compound modified EVA encapsulation film, obtained by the following preparation method: 100 parts by weight of ethylene-vinyl acetate copolymer, 10 parts by weight of reinforcing resin, 1 part by weight of crosslinking agent, 0.12 parts by weight antioxidant, 0.12 parts by weight of UV absorber, 0.08 parts by weight of light stabilizer, 0.5 parts by weight of silane coupling agent, 0.5 parts by weight of fluorine-containing compound, 0.8 parts by weight of tackifier, 0.01 parts by weight of The modified processing aid is mixed evenly by a mixer, then put into a casting machine, and plasticized, extruded, stretched, drawn, and rolled at 115°C to make an EVA film with a thickness of about 0.5mm.

[0021] Among them, the reinforced resin is a mixture of polybutene and ethylene-propylene rubber, and its mass ratio is 1:1.

[0022] Wherein, the composition of the modified processing aid in parts by mass is as follows: 28 parts of polyurethane resin, 18 parts of po...

Embodiment 2

[0030] A kind of EVA encapsulation adhesive film modified by fluorine compound, obtained by following preparation method: the ethylene-vinyl acetate copolymer of 100 parts by weight, the reinforcing resin of 12 parts by weight, the crosslinking agent of 1.2 parts by weight, the crosslinking agent of 0.2 parts by weight antioxidant, 0.2 parts by weight of UV absorber, 0.12 parts by weight of light stabilizer, 0.8 parts by weight of silane coupling agent, 2 parts by weight of fluorine-containing compounds, 1 part by weight of tackifier, 0.02 parts by weight of The modified processing aid is mixed evenly by a mixer, then put into a casting machine, and plasticized, extruded, stretched, drawn, and rolled at 115°C to make an EVA film with a thickness of about 0.5mm.

[0031] Among them, the reinforced resin is a mixture of polybutene and ethylene-propylene rubber, and its mass ratio is 1:1.

[0032] Wherein, the composition of the modified processing aid in parts by mass is as foll...

Embodiment 3

[0040] A fluorine compound modified EVA encapsulation film, obtained by the following preparation method: 100 parts by weight of ethylene-vinyl acetate copolymer, 15 parts by weight of reinforcing resin, 2 parts by weight of crosslinking agent, 0.36 parts by weight antioxidant, 0.36 parts by weight of UV absorber, 0.24 parts by weight of light stabilizer, 1.5 parts by weight of silane coupling agent, 20 parts by weight of fluorine-containing compound, 1.5 parts by weight of tackifier, 0.04 parts by weight of The modified processing aid is mixed evenly by a mixer, then put into a casting machine, and plasticized, extruded, stretched, drawn, and rolled at 115°C to make an EVA film with a thickness of about 0.5mm.

[0041] Among them, the reinforced resin is a mixture of polybutene and ethylene-propylene rubber, and its mass ratio is 1:1.

[0042] Wherein, the composition of the modified processing aid in parts by mass is as follows: 30 parts of polyurethane resin, 19 parts of poly...

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Abstract

The invention relates to the technical field of photovoltaic module packaging, and particularly relates to a fluorine compound modified EVA (Ethylene Vinyl Acetate Copolymer) packaging glue film. Thefluorine compound modified EVA packaging glue film is prepared by a preparation method as follows: 100 weight parts of EVA, 10 to 20 weight parts of reinforced resin, 1 to 3 weight parts of cross-linking agent, 0.12 to 0.45 weight parts of antioxidant, 0.12 to 0.45 weight parts of ultraviolet absorber, 0.08 to 0.4 weight part of light stabilizer, 0.5 to 2.5 weight parts of silane coupling agent, 0.5 to 40 weight parts of fluorinated compound, 0.8 to 2 weight parts of tackifier, 0.01 to 0.08 weight parts of modification processing assistant are uniformly mixed by a mixer; then the mixture is put into a casting film machine; at a temperature of 115 DEG C, by plastifying extrusion, stretching, traction and rolling-up, preparing the EVA glue film with a thickness of about 0.5 mm. The glue filmin the invention has excellent water vapor barrier property, hydrolysis resistance and insulativity, and can effectively resist to a PID (Potential-Induced Degradation) phenomenon; the added modification processing assistant, tackifier and reinforced resin improve the stability of the EVA packaging glue film and the mechanical stability such as tensile resistance of the EVA packaging glue film.

Description

technical field [0001] The invention relates to the technical field of photovoltaic module packaging, in particular to a fluorine compound-modified EVA packaging adhesive film. Background technique [0002] The full name of PID is potential-induced degradation (Potential-induced degradation), which was first discovered by Sunpower in 2005. It means that under the action of high voltage, there is a leakage current between the glass and the packaging material, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface and leads to a sharp drop in the photoelectric conversion efficiency of the photovoltaic module. The reduction can reach 80-90%. [0003] The external conditions that cause the PID phenomenon of photovoltaic modules are mainly high voltage, humidity, and high temperature. Under these conditions, there are many free-moving metal ions in photovoltaic modules due to corrosion or materials. At t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/30C09J123/08C09J11/06C09J11/08
CPCC08L2201/14C08L2203/204C08L2205/035C08L2205/16C09J7/10C09J7/30C09J11/06C09J11/08C09J123/0853C09J2301/408C09J2423/04C08L23/20C08L23/16C08L75/04C08L67/00C08L83/08C08K5/00C08K5/14C08K5/524C08K5/3475C08K5/42
Inventor 吕松
Owner CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL