Adjustment device with tensioning jaw coupling for vacuum area

Abstract

The invention relates to an adjustment device with a tensioning jaw coupling for a vacuum area. The vacuum adjustment device comprises a coupling for coupling an active element and a drive unit cooperating with the coupling. The coupling can be adjusted from a normal position in which the active element is present in an essentially non-effective state with respect to its intended effect, into an active position, in which the active element provides its intended effect in the coupled state, and back again. The device also has a separating device for separating the process atmosphere region froman outer atmosphere region, wherein the drive unit is at least partially associated with the outer atmosphere region and the coupling in particular with the process atmosphere region. The coupling has a collet and locking elementcooperating with the collet. The coupling defines a receiving axis for receiving the active element or a coupling device of the active element. The collet and the lockingelement are arranged axially along or parallel to the receiving axis in relation to such a relative position variation that the locking element is adjustable relative to the collet in an open position and in a closed position, in particular displaceable. The coupling provides an open changing state by interaction of the collet with the locking element in the open position and a closed working state in the closed position.

Description

technical field [0001] The invention relates to an in-process atmosphere for an active element (Wirkelement) that can be joined to a drive unit with a connector Vacuum adjustment device for medium movement and positioning. Background technique [0002] Such adjustment devices designed for the vacuum zone are used, for example, to position substrates to be processed in the vacuum chamber. The substrate is generally brought into the processing space by means of a robot, where it has to rest at a defined placement point in the chamber and be removed from this point after processing. Positioning and movement within the treatment chamber is achieved by means of specific adjustment devices, so-called pin ejector systems (also called pin ejectors). [0003] The ejector system is used in particular in vacuum chamber systems in the field of integrated circuit processing, semiconductor processing, flat panel processing or substrate processing, where the above processing has to take...

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Problems solved by technology

[0026] This fact is also disadvantageous when a problem occurs unexpectedly within the system that requires temporary quick intervention (such as a broken support pin)

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