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Chip package structure and packaging method

A packaging structure and packaging method technology, applied in the directions of microstructure devices, manufacturing microstructure devices, microstructure technology, etc., can solve the problems of large thickness of the packaging structure, and achieve the effect of reducing the thickness

Inactive Publication Date: 2019-03-08
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the thickness of the packaging structure formed by the MEMS chip and the VCSEL chip is relatively large.

Method used

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  • Chip package structure and packaging method
  • Chip package structure and packaging method

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Embodiment Construction

[0075] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0076] see figure 1 , figure 1 The VCSEL (Vertical Cavity Surface Emitting Laser, VCSEL chip) chip interacts with the micro-vibrating mirror on the MEMS chip to realize the scanning working principle; the MEMS chip 02 can control the deflection of the vibrating mirror to achieve the effect of reciprocating scanning. Such as figure 1 As shown in , the galvanometer 021 is deflected from the state L1 to the state L2, and the reflected laser light is deflected a...

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Abstract

The technical scheme of the present invention discloses a chip package structure and a packaging method, in the structure, a MEMS chip, a VCSEL chip and a transparent cover plate are installed on a circuit board, and the transparent cover plate has a reflective structure, and the reflective structure is integrated on the transparent cover plate; the structure does not need to separately set the reflective structure and reduces thickness of the package structure.

Description

technical field [0001] The present invention relates to the technical field of chip packaging, more particularly, to a chip packaging structure and packaging method. Background technique [0002] Laser has unique optical characteristics, such as high monochromaticity and strong directionality, which make the development of VCSEL chip components faster and faster, and the application range is wider and wider. In particular, due to the strong directivity of the laser, it can maintain the quality of the light spot within a certain distance without the use of a lens, making it the preferred light source for barcode scanning. [0003] At present, in the barcode scanning process, in addition to using a laser chip (VCSEL chip) as a laser light source, a scanning device that controls the laser to scan is also required. Usually, a MEMS (Micro-Electro-Mechanical Systems, Micro-Electro-Mechanical Systems) with a vibrating mirror is used. ) The chip controls the laser to scan. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02B81C1/00H01S5/00
CPCB81B7/0067B81B7/02B81C1/00261B81C1/00317H01S5/005
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP